Curing light
First Claim
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1. A curing light comprising:
- a primary heat sink capable of dissipating heat created by a semiconductor light source, a well in said heat sink, said well being sized to receive a semiconductor chip capable of producing light that is useful in curing light-curable materials, a top opening of said well, a bottom of said well, a wall of said well, said wall of said well being capable of reflecting light, a semiconductor chip capable of producing light that is useful in curing light-curable materials, said semiconductor chip having a substrate, said semiconductor chip having a plurality of epitaxial layers, at least one of said epitaxial layers being an active layer.
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Abstract
A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
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Citations
20 Claims
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1. A curing light comprising:
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a primary heat sink capable of dissipating heat created by a semiconductor light source, a well in said heat sink, said well being sized to receive a semiconductor chip capable of producing light that is useful in curing light-curable materials, a top opening of said well, a bottom of said well, a wall of said well, said wall of said well being capable of reflecting light, a semiconductor chip capable of producing light that is useful in curing light-curable materials, said semiconductor chip having a substrate, said semiconductor chip having a plurality of epitaxial layers, at least one of said epitaxial layers being an active layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 15, 16, 17, 18, 20)
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14. A curing light comprising:
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a primary heat sink capable of dissipating heat created by a semiconductor light source, a well in said heat sink, said well being sized to receive a semiconductor chip capable of producing light that is useful in curing light-curable materials, a top opening of said well, a bottom of said well, a wall of said well, said wall of said well being capable of reflecting light, a semiconductor chip capable of producing light that is useful in curing light-curable materials, said semiconductor chip having a substrate, said substrate being selected from the group consisting of Si, GaAs, GaN, InP, sapphire, SiC, GaSb, and InAs, said semiconductor chip having a plurality of epitaxial layers, a contact layer as one of said epitaxial layers, said contact layer serving to establish an electrical contact for said chip, a cladding layer as one of said epitaxial layers, an active layer as one of said epitaxial layers, said active layer serving to allow electrons jump from a conduction band to valance and emit energy which converts to light, and a buffer layer as one of said epitaxial layers.
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19. A curing light comprising:
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a housing for containing components of the curing light, a handpiece of manipulation and applying light from the curing light to a light-curable material, electronic circuitry for controlling the curing light, a primary heat sink capable of dissipating heat created by a semiconductor light source, a semiconductor chip capable of producing light that is useful in curing light-curable materials, said semiconductor chip being affixed to said primary heat sink by use of an adhesive, said semiconductor chip having a substrate, said substrate being selected from the group consisting of Si, GaAs, GaN, InP, sapphire, SiC, GaSb, and InAs, said semiconductor chip having a plurality of epitaxial layers, a contact layer as one of said epitaxial layers, said contact layer serving to establish an electrical contact for said chip, a cladding layer as one of said epitaxial layers, an active layer as one of said epitaxial layers, said active layer serving to allow electrons jump from a conduction band to valance and emit energy which converts to light, and a buffer layer as one of said epitaxial layers;
wherein at least one of said epitaxial layers includes a material from the group consisting of GaN, AlGaN, and InGaN.
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Specification