×

Contact planarization using nanoporous silica materials

  • US 20020168876A1
  • Filed: 10/26/2001
  • Published: 11/14/2002
  • Est. Priority Date: 09/09/1999
  • Status: Active Grant
First Claim
Patent Images

1. A substantially planarized nanoporous dielectric silica coating on a substrate formed by a process comprising:

  • applying a composition that comprises a silicon-based precursor onto a substrate to form a coating on said substrate, and conducting the following steps;

    (a) gelling or aging the applied coating, (b) contacting the coating with a planarization object with sufficient pressure to transfer an impression of the object to the coating without substantially impairing formation of desired nanometer-scale pore structure, (c) separating the planarized coating from the planarization object, (d) curing said planarized coating;

    wherein steps (a)-(d) are conducted in a sequence selected from the group consisting of (a), (b), (c) and (d);

    (a), (d), (b) and (c);

    (b), (a), (d) and (c);

    (b), (a), (c) and (d); and

    (b), (c), (a) and (d).

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×