Contact planarization using nanoporous silica materials
First Claim
1. A substantially planarized nanoporous dielectric silica coating on a substrate formed by a process comprising:
- applying a composition that comprises a silicon-based precursor onto a substrate to form a coating on said substrate, and conducting the following steps;
(a) gelling or aging the applied coating, (b) contacting the coating with a planarization object with sufficient pressure to transfer an impression of the object to the coating without substantially impairing formation of desired nanometer-scale pore structure, (c) separating the planarized coating from the planarization object, (d) curing said planarized coating;
wherein steps (a)-(d) are conducted in a sequence selected from the group consisting of (a), (b), (c) and (d);
(a), (d), (b) and (c);
(b), (a), (d) and (c);
(b), (a), (c) and (d); and
(b), (c), (a) and (d).
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Abstract
A process for forming a substantially planarized nanoporous dielectric silica coating on a substrate suitable for preparing a semiconductor device, and semiconductor devices produced by the methods of the invention. The process includes the steps of applying a composition that includes at least one silicon-based dielectric precursor to a substrate, and then,
(a) gelling or aging the applied coating,
(b) contacting the coating with a planarization object with sufficient pressure to transfer a planar impression to the coating without substantially impairing formation of desired nanometer-scale pore structure,
(c) separating the planarized coating from the planarization object,
(d) curing said planarized coating;
wherein steps (a)-(d) are conducted in any one of the following sequences:
(a), (b), (c) and (d);
(a), (d), (b) and (c);
(b), (a), (d) and (c); and
(b), (c), (a) and (d).
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Citations
32 Claims
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1. A substantially planarized nanoporous dielectric silica coating on a substrate formed by a process comprising:
- applying a composition that comprises a silicon-based precursor onto a substrate to form a coating on said substrate, and conducting the following steps;
(a) gelling or aging the applied coating, (b) contacting the coating with a planarization object with sufficient pressure to transfer an impression of the object to the coating without substantially impairing formation of desired nanometer-scale pore structure, (c) separating the planarized coating from the planarization object, (d) curing said planarized coating;
wherein steps (a)-(d) are conducted in a sequence selected from the group consisting of (a), (b), (c) and (d);
(a), (d), (b) and (c);
(b), (a), (d) and (c);
(b), (a), (c) and (d); and
(b), (c), (a) and (d). - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 25, 27, 28, 29, 30, 31)
- applying a composition that comprises a silicon-based precursor onto a substrate to form a coating on said substrate, and conducting the following steps;
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24. A process for forming a substantially planarized nanoporous dielectric silica coating on a substrate comprising:
- applying a composition that comprises a silicon-based precursor onto a substrate to form a coating on said substrate, and conducting the following steps;
(a) gelling or aging the applied coating, (b) contacting the coating with a planarization object with sufficient pressure to transfer an impression of the object to the coating without substantially impairing formation of desired nanometer-scale pore structure, (c) separating the planarized coating from the planarization object, (d) curing said planarized coating;
wherein steps (a)-(d) are conducted in a sequence selected from the group consisting of (a), (b), (c) and (d);
(a), (d), (b) and (c);
(b), (a), (d) and (c);
(b), (a), (c) and (d); and
(b), (c), (a) and (d).
- applying a composition that comprises a silicon-based precursor onto a substrate to form a coating on said substrate, and conducting the following steps;
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26. A dielectric silica coating on a substrate with a pattern impressed thereon by a process comprising:
- coating a substrate with a composition comprising a precursor for forming a nanoporous dielectric film, contacting said coating with a desired patterned surface with a pressure and for a time period sufficient in impress the pattern on said coating, and then separating the patterned surface from said coating.
- View Dependent Claims (32)
Specification