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System and method of processing composite substrates within a high throughput reactor

  • US 20020170673A1
  • Filed: 12/26/2001
  • Published: 11/21/2002
  • Est. Priority Date: 04/29/2000
  • Status: Abandoned Application
First Claim
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1. A wafer susceptor for use in a substrate processing system, comprising:

  • at least one recess formed therein, with each recess is arranged and configured to hold at least one substrate therein, wherein a combination of said wafer holder and said at least one substrate forms a composite substrate having uniform processing characteristics.

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