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Sputtering system

  • US 20020170822A1
  • Filed: 02/15/2002
  • Published: 11/21/2002
  • Est. Priority Date: 02/15/2001
  • Status: Active Grant
First Claim
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1. A sputtering system for depositing a thin film on a substrate, comprising:

  • a vacuum chamber;

    a support for supporting the substrate in the vacuum chamber;

    a target arranged to oppose the support;

    a fixed plate formed on a first side of the target; and

    a plurality of electromagnets formed on the fixed plate in a cell pattern.

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