Methods for preparing ball grid array substrates via use of a laser
First Claim
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1. A resist removal method comprising:
- providing a substrate having a surface;
forming resist on at least a portion of the surface; and
providing a laser to remove the resist from the substrate.
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Abstract
The present invention relates to the use of a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.
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23 Claims
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1. A resist removal method comprising:
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providing a substrate having a surface;
forming resist on at least a portion of the surface; and
providing a laser to remove the resist from the substrate. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor device formed by a laser etching process comprising:
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providing a substrate having a surface;
forming resist on at least a portion of the surface; and
etching the resist from the surface c f the substrate using a laser. - View Dependent Claims (8, 9, 10, 11, 12, 14, 15, 16, 17, 18)
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13. A method of fabricating a semiconductor device comprising:
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providing a substrate having a surface;
forming resist on at least a portion of the surface;
laser etching the resist from the surface of the substrate; and
encapsulating the substrate.
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19. A method of enhancing the adhesion of a compound to a surface of a substrate comprising:
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providing a substrate having a surface;
roughening the surface of the substrate.
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21. An automolding system comprising:
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providing a substrate having a surface;
preheating the substrate;
forming a resist layer;
baking the substrate; and
removing contaminants from the substrate using a laser. - View Dependent Claims (20, 22, 23)
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Specification