DATA INPUT DEVICE USING A LAMINATED SUBSTRATE CAPABLE OF RELIABLY FILLING THROUGH HOLES WITH ELECTROCONDUCTIVE MATERIAL

• US 20020171634A1
• Filed: 12/09/1999
• Published: 11/21/2002
• Est. Priority Date: 12/18/1998
• Status: Abandoned Application

• Current Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Original Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Inventors: MATSUFUSA, HIDETO
• Application Number:
  US09/457,585
• Publication Number:
  US 20020171634A1
• Time in Patent Office: Days
• US Class Current: 345/173
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: G06F 3/047 using sets of wires, e.g. crossed wires
• CPC Class Codes: H05K 1/0289 having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
• CPC Class Codes: H05K 1/116 Lands, clearance holes or other lay-out details concerning the surrounding of a via
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/09981 Metallised walls
• CPC Class Codes: H05K 2203/1178 Means for venting or for letting gases escape
• CPC Class Codes: H05K 2203/1453 Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
• CPC Class Codes: H05K 3/4069 for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence

Abstract

A laminated substrate includes a first substrate having electrodes and through-holes formed thereon, a second substrate having wiring patterns formed thereon and laminated under the first substrate through an insulating layer, an electroconductive material filled in the through-holes so that the electrodes of the first substrate are electrically conducted to the wiring patterns of the second substrate therethrough, and air vent passages having longitudinal paths passing through the first substrate and communicating with the outside from the front surface of the first substrate and lateral paths located between the first substrate and the second substrate for communicating the longitudinal paths with the through-holes. With this arrangement, when both the substrates are electrically conducted to each other, the electrodes of the first substrate are electrically conducted to the wiring patterns of the second substrate reliably through the conductive material which is filled in the through-holes securely.

Claims

1. A laminated substrate comprising:

a first substrate having electrodes and through-holes formed thereon;

a second substrate having wiring patterns formed thereon and laminated under said first substrate through an insulating layer;

an electroconductive material filled in the through-holes so that the electrodes of said first substrate are electrically connected to the wiring patterns of the second substrate therethrough; and

air vent passages having longitudinal paths passing through said first substrate and communicating with the outside from the front surface of said first substrate and lateral paths located between said first substrate and said second substrate for communicating the longitudinal paths with the through-holes.

2. A laminated substrate according to claim 1, wherein:

through-holes are formed on the second substrate so as to communicate with the through-holes of said first substrate and the air vent passages; and

the wiring patterns formed on the side of said second substrate opposite to the first substrate are electrically connected to the electroconductive material.

3. A laminated substrate according to claim 1, wherein:

the electrodes of said first substrate are disposed on at least the side thereof confronting said second substrate; and

at least portions of the electrodes of said first substrate disposed on the side thereof confronting said second substrate confront the lateral paths.

4. A laminated substrate according to claim 1, wherein the lateral paths are disposed to a resist layer covering a surface of said first substrate.

5. A data input device comprising a laminated substrate according to any of claims 1 to 4 wherein said first substrate has x-electrodes and y-electrodes, which are insulated from each other, formed thereon and the change of capacitance between the x-electrodes and the y-electrodes can be detected.

6. A data input device according to claim 5, wherein:

a ground pattern is formed along the edges of said first substrate;

the ground pattern exposed from the edges of said first substrate is arranged as a frame ground for discharging capacitance; and

a face sheet is laminated on said first substrate through an insulating member.