Structure and method for fabrication of a leadless chip carrier with embedded inductor

• US 20020172025A1
• Filed: 08/14/2001
• Published: 11/21/2002
• Est. Priority Date: 11/15/2000
• Status: Active Grant

• Current Assignee: Hassan S. Hashemi, Mohamed Megahed
• Original Assignee: Skyworks Solutions Incorporated
• Inventors: Hashemi, Hassan S., Megahed, Mohamed
• Granted Patent: US 6,710,433 B2
• Time in Patent Office: Days
• US Class Current: 361/767
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15313 : being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base

Abstract

One embodiment comprises a substrate having a top surface for receiving a semiconductor die. According to a disclosed embodiment, an inductor is patterned on the top surface of the substrate. The inductor is easily accessible by connecting its first and second terminals to, respectively, a substrate signal bond pad and a semiconductor die signal bond pad. In another disclosed embodiment, an inductor is fabricated within the substrate. The inductor comprises via metal segments connecting interconnect metal segments on the top and bottom surfaces of the substrate. The first and second terminals of the inductor are easily accessible through first and second substrate signal bond pads. One embodiment comprises at least one via in the substrate. The at least one via provides an electrical connection between a signal bond pad of the semiconductor die and a printed circuit board attached to the bottom surface of the substrate.

Claims

1. A structure comprising:

a substrate having a top surface for receiving a die;

a conductor patterned on said top surface of said substrate, a first terminal of said conductor being adapted for connection to a first substrate signal bond pad and a second terminal of said conductor being adapted for connection to a first die signal bond pad;

a printed circuit board attached to a bottom surface of said substrate;

at least one via in said substrate;

said at least one via providing an electrical connection between a second die signal bond pad and said printed circuit board.

2. The structure of claim 1 wherein said die is a semiconductor die.

3. The structure of claim 1 wherein said substrate comprises an organic material.

4. The structure of claim 1 wherein said substrate comprises a ceramic material.

5. The structure of claim 1 wherein said at least one via provides an electrical connection between a second substrate signal bond pad and said printed circuit board, wherein said second substrate signal bond pad is electrically connected to said second die signal bond pad.

6. The structure of claim 5 wherein said second substrate signal bond pad is electrically connected to said second die signal bond pad by a bonding wire.

7. The structure of claim 1 wherein said at least one via provides an electrical connection between said second die signal bond pad and a land, said land being electrically connected to said printed circuit board.

8. The structure of claim 1 wherein said at least one via provides an electrical connection between a second substrate signal bond pad and a land, wherein said second substrate signal bond pad is electrically connected to said second die signal bond pad, and wherein said land is electrically connected to said printed circuit board.

9. The structure of claim 8 wherein said second substrate signal bond pad is electrically connected to said second die signal bond pad by a bonding wire.

10. The structure of claim 1 wherein said at least one via comprises a thermally conductive material.

11. The structure of claim 1 wherein said conductor is an inductor.

12. The structure of claim 11 wherein said first terminal of said inductor is connected to said first substrate signal bond pad and said second terminal of said inductor is connected to said first die signal bond pad.

14. The structure of claim 13 wherein said die is a semiconductor die.

15. The structure of claim 13 wherein said substrate comprises an organic material.

16. The structure of claim 13 wherein said substrate comp rises a ceramic material.

17. The structure of claim 13 wherein said at least one via provides an electrical connection between said die signal bond pad and a land, said land being electrically connected to said printed circuit board.

18. The structure of claim 13 wherein said at least one via comprises a thermally conductive material.

19. The structure of claim 13 wherein said conductor comprises a plurality of via metal segments within said substrate.

20. The structure of claim 19 wherein said conductor is an inductor.

13. A structure comprising:

a substrate having a top surface for receiving a die;

a conductor patterned within said substrate, a first substrate signal bond pad being a first terminal of said conductor and a second substrate signal bond pad being a second terminal of said conductor;

a printed circuit board attached to a bottom surface of said substrate;

at least one via in said substrate;

said at least one via providing an electrical connection between a die signal bond pad and said printed circuit board.

21. A method for fabricating a structure for receiving a semiconductor die, said method comprising steps of:

drilling a first hole in a substrate;

filling said first hole with metal to form a first via;

patterning a conductor on a top surface of said substrate, a first terminal of said conductor being adapted for connection to a substrate signal bond pad and a second terminal of said conductor being adapted for connection to a die signal bond pad;

patterning a support pad on said top surface of said substrate, and patterning a heat spreader on a bottom surface of said substrate, said first via providing an electrical connection between said heat spreader and said support pad, said support pad being suitable for receiving said semiconductor die.

22. The method of claim 21 wherein said substrate comprises an organic material.

23. The method of claim 21 wherein said substrate comprises a ceramic material.

24. The method of claim 21 further comprising a step of attaching said bottom surface of said substrate to a printed circuit board.

25. The method of claim 24 wherein said first via provides an electrical connection between said die signal bond pad and a land, said land being electrically connected to said printed circuit board.

26. The method of claim 21 wherein said first via comprises a thermally conductive material.

27. The method of claim 21 wherein said conductor is an inductor.

29. The method of claim 28 wherein said substrate comprises an organic material.

30. The method of claim 28 wherein said substrate comprises a ceramic material.

31. The method of claim 28 further comprising a step of attaching said bottom surface of said substrate to a printed circuit board.

32. The method of claim 31 wherein said first via provides an electrical connection between a die signal bond pad and a land, said land being electrically connected to said printed circuit board.

33. The method of claim 28 wherein said first via comprises a thermally conductive material.

34. The method of claim 28 wherein said conductor comprises a plurality of via metal segments within said substrate.

35. The method of claim 34 wherein said conductor is an inductor.

28. A method for fabricating a structure for receiving a semiconductor die, said method comprising steps of:

patterning a conductor within a substrate, a first substrate signal bond pad being a first terminal of said conductor and a second substrate signal bond pad being a second terminal of said conductor;

patterning a support pad on a top surface of said substrate, and patterning a heat spreader on a bottom surface of said substrate, a first via providing an electrical connection between said heat spreader and said support pad, said support pad being suitable for receiving said semiconductor die.