Dielectric laminate for a capacitor

• US 20020176989A1
• Filed: 04/16/2002
• Published: 11/28/2002
• Est. Priority Date: 04/16/2001
• Status: Abandoned Application

• Current Assignee: Shipley Company, LLC (Dow, Inc.)
• Original Assignee: Shipley Company, LLC (Dow, Inc.)
• Inventors: Knudsen, Philip D., Allen, Craig S.
• Application Number:
  US10/124,613
• Publication Number:
  US 20020176989A1
• Time in Patent Office: Days
• US Class Current: 428/408
• CPC Class Codes: H01G 4/206 inorganic and synthetic material
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/0175 Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
• CPC Class Codes: H05K 2201/0179 Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
• CPC Class Codes: H05K 2201/0195 Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
• CPC Class Codes: H05K 2201/0323 Carbon
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: Y10T 428/24975 No layer or component greater than 5 mils thick
• CPC Class Codes: Y10T 428/30 Self-sustaining carbon mass or layer with impregnant or other layer

Abstract

A dielectric composed of a core material between two polymer layers that have permittivity values less than the core material. The polymer layers provide structural integrity for the dielectric. The dielectric can be employed in a capacitor to fine tune the capacitance of the capacitor. The dielectric and the capacitor may have a thickness in the micron range. Accordingly, the dielectric and capacitor provide for the miniaturization of electronic devices. The dielectric may be employed in decoupling capacitors to reduce noise in electronic devices.

Claims

1. A dielectric laminate comprising a core layer bonded to a first polymer layer and to a second polymer layer, the core layer has a permittivity higher than the first polymer layer and the second polymer layer, the first and second polymer layers provide a means such that the dielectric laminate is self-supporting.

2. The dielectric laminate of claim 1, wherein the core layer comprises a carbon material, a ceramic material, or mixtures thereof.

3. The dielectric laminate of claim 2, wherein the carbon material comprises diamond, and the ceramic material comprises silicon carbide, silica, silica based compositions, barium strontium titanate, barium titanium oxide, strontium titanium oxide, tungsten oxide, mixed tungsten strontium oxides, barium tungsten oxide, mixed tungsten strontium barium oxides, CeO₂, Ta₂O₅, TiO₂, MnO₂, Y₂O₃, PbZrTiO₃, LiNbO₃, PbMgTiO₃, PbMgNbO₃, or mixtures thereof.

4. The dielectric laminate of claim 1, wherein the first and second polymer layers comprise thermoplastic polymers, thermosetting polymers, addition polymers, condensation polymers or mixtures thereof.

5. The dielectric laminate of claim 1, wherein the first or second polymer layer comprises an inorganic polymer.

6. The dielectric laminate of claim 5, wherein the inorganic polymer is derived from metal complex compounds, compounds having the general formula M(OR)_n, or compounds having the general formula M[M₁(OR)_n]_m, where M is a metal, boron, phosphorous or silicon, M₁ is a metal different from M, R is a linear or branched alkyl group, n is an integer of 1 or greater, and m is an integer of 1 or greater.

7. The dielectric laminate of claim 1, wherein the polymer layers comprise polymers having a T_g of at least about 90°

C.

8. The dielectric laminate of claim 1, wherein the dielectric laminate has a thickness of from about 5 μ

m to about 1000 μ

m.

9. The dielectric laminate of claim 1, wherein the core layer has a thickness of from about 0.05 μ

m to about 900 μ

m.

10. The dielectric of claim 1, wherein the polymer thickness is from about 2.0 μ

m to about 500 μ

m.

11. The dielectric laminate of claim 1, wherein the dielectric laminate comprises a self-supporting bulk sheet.

12. The dielectric laminate of claim 1, further comprising a first metal layer adjacent to the first polymer layer, and a second metal layer adjacent to the second polymer layer to form a capacitor.

13. The dielectric laminate of claim 12, wherein the first and second metal layer comprise copper, nickel, tin, aluminum, gold, silver, platinum, palladium, tungsten, iron, niobium, molybdenum, titanium, nickel/chromium alloy, or iron/nickel/chromium alloy.

14. The dielectric laminate of claim 12, wherein a capacitance density of the capacitor is less than about 1000 μ

F/cm².

15. The dielectric laminate of claim 12, wherein the core layer has a permittivity of greater than 20.

16. The dielectric laminate of claim 12, wherein the capacitor is embedded in a printed wiring board.

18. The method of claim 17, wherein the core dielectric is deposited on the first polymer layer by combustion chemical vapor deposition, or controlled atmosphere combustion chemical vapor deposition.

19. The method of claim 18, wherein the core dielectric is deposited on the first polymer layer by combustion chemical vapor deposition with a flame temperature from about 100°

C. to about 1500°

C.

20. The method of claim 18, wherein the core dielectric is deposited on the first polymer layer as a plasma by combustion chemical vapor deposition, the plasma has a temperature of from about 800°

C. to about 2000°

C.

21. The method of claim 17, wherein the core dielectric material comprises diamond, silicon carbide, silica, silica based compositions, barium strontium titanate, barium titanium oxide, tungsten oxide, strontium oxide, barium tungsten oxide, tungsten strontium barium oxides, tungsten strontium oxides, manganese oxide, CeO₂, Ta₂O₅, Y₂O₃, PbZrTiO₃, LiNbO₃, PbMgTiO₃, PbMgNbO₃, or mixtures thereof.

22. The method of claim 17, wherein the first and second polymer layers comprise thermoplastic polymers, thermosetting polymers, addition polymers, condensation polymers, or copolymers, grafts, blends or mixtures thereof.

23. The method of claim 17, wherein the first or second polymer layer is an inorganic polymer derived from metal complex compounds, a compound having a general formula M(OR)_n, or M[M₁(OR)_n]_m, where M is a metal, boron, phosphorous or silicon, M₁ is a metal different than M, R is a linear or branched alkyl group, n is an integer of 1 or greater, and m is an integer of 1 or greater.

17. A method for forming a self-supporting dielectric comprising:

depositing on a first polymer layer a core dielectric material; and

depositing a second polymer layer on a surface of the core dielectric opposite the first polymer layer to form the self-supporting dielectric, the core has a permittivity higher than the first and the second polymer layers.