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Integrated lancets and methods

  • US 20020177763A1
  • Filed: 05/22/2001
  • Published: 11/28/2002
  • Est. Priority Date: 05/22/2001
  • Status: Abandoned Application
First Claim
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1. A lancet comprising:

  • a semiconductor die having an integral needle-like pointed protrusion, a plurality of electrodes and a selective reagent on a surface of the protrusion and in electrical contact with at least two of the electrodes.

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