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Semiconductor device

  • US 20020180037A1
  • Filed: 09/07/2001
  • Published: 12/05/2002
  • Est. Priority Date: 05/30/2001
  • Status: Abandoned Application
First Claim
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1. A semiconductor device comprising a positive polarity wiring plate, a negative polarity wiring plate, an output wiring plate, a semiconductor switch element, and a conductive buffer material, said semiconductor switch element and said buffer material being compressively interposed between said output wiring plate and positive polarity wiring plate and also between said output wiring plate and negative polarity wiring plate for constitution of bridge circuitry, wherein any one of said positive polarity wiring plate, said negative polarity wiring plate and said output wiring plate is adapted for use as one support body of a pressurization structure.

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