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Method for analyzing defect data and inspection apparatus and review system

  • US 20020181756A1
  • Filed: 04/10/2002
  • Published: 12/05/2002
  • Est. Priority Date: 04/10/2001
  • Status: Active Grant
First Claim
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1. A method of analyzing defect data, comprising the step of classifying defects detected as a result of inspecting a processed substrate that results from processing said substrate to form a circuit pattern thereon, wherein said classification is made to specify at least any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect of distribution feature categories on the basis of the position coordinates of said defects.

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