Optical fiber attached to a substrate

• US 20020181880A1
• Filed: 04/19/2002
• Published: 12/05/2002
• Est. Priority Date: 04/23/2001
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Shipley Company, LLC (Dow, Inc.)
• Inventors: Dautartas, Mindaugas F., Meder, Martin G.
• Granted Patent: US 6,782,182 B2
• Time in Patent Office: Days
• US Class Current: 385/51
• CPC Class Codes: G02B 6/3636 the mechanical coupling means being grooves G02B6/3652 takes precedence
• CPC Class Codes: G02B 6/3652 the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
• CPC Class Codes: G02B 6/3692 with surface micromachining involving etching, e.g. wet or dry etching steps surface micromachining involving subtractive techniques B81C1/00055
• CPC Class Codes: G02B 6/3861 Adhesive bonding adhesives in general C09J

Abstract

The invention includes an optical fiber device, comprising at least one optical fiber over a substrate, at least one reentrant shape in the substrate adjacent to the optical fiber and a polymer that at least partially encapsulates the optical fiber and attaches the optical fiber to the at least one reentrant shape and methods for making the same.

Claims

1. An optical fiber device, comprising:

at least one optical fiber over a substrate;

at least one reentrant shape in the substrate adjacent to the optical fiber; and

a polymer that at least partially encapsulates the optical fiber and attaches the optical fiber to the at least one reentrant shape.