Wireless IC interconnection method and system
First Claim
1. A wireless integrated circuit (IC) interconnection system, comprising:
- a wireless transmission medium, a transmitter which modulates a signal to be conveyed from a first IC location to a second IC location and provides said modulated signal at an output, a first capacitive coupler which capacitively couples said modulated signal from said transmitter output to said wireless transmission medium, a second capacitive coupler which capacitively couples said modulated signal from said wireless transmission medium to a receiver, said wireless transmission medium propagating said modulated signal from said first capacitive coupler to said second capacitive coupler, and a receiver which demodulates said modulated signal and provides said demodulated signal to said second IC location.
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Accused Products
Abstract
A wireless IC interconnect system and method facilitates interconnections between first and second IC locations via a wireless transmission medium; the IC locations may be on the same chip or on separate chips. A signal to be conveyed is modulated, and the modulated signal is capacitively coupled to the wireless transmission medium—preferably a properly terminated microstrip transmission line (MTL) or a coplanar waveguide (CPW). The modulated signal is capacitively coupled from the wireless medium to a receiver which demodulates the modulated signal and provides the demodulated signal to the second IC location. In a preferred embodiment, the wireless transmission system conveys numerous signals simultaneously, with the signals modulated and demodulated with multiple access algorithms such as code-division (CDMA) and/or frequency-division (FDMA) multiple access algorithms. The interconnection system can be made reconfigurable, with the destinations of the modulated signals changed by reprogramming associated address codes.
34 Citations
34 Claims
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1. A wireless integrated circuit (IC) interconnection system, comprising:
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a wireless transmission medium, a transmitter which modulates a signal to be conveyed from a first IC location to a second IC location and provides said modulated signal at an output, a first capacitive coupler which capacitively couples said modulated signal from said transmitter output to said wireless transmission medium, a second capacitive coupler which capacitively couples said modulated signal from said wireless transmission medium to a receiver, said wireless transmission medium propagating said modulated signal from said first capacitive coupler to said second capacitive coupler, and a receiver which demodulates said modulated signal and provides said demodulated signal to said second IC location. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A wireless integrated circuit (IC) interconnection system, comprising:
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a wireless transmission medium, a plurality of transmitters, each of which modulates a respective signal to be conveyed from a first IC location to a second IC location and provides said modulated signal at an output, a first plurality of capacitive couplers, each of which capacitively couples a respective one of said modulated signals from its respective transmitter output to said wireless transmission medium, a second plurality of capacitive couplers, each of which capacitively couples said modulated signals from said wireless transmission medium to a respective receiver, said wireless transmission medium propagating said modulated signals from said first plurality of capacitive couplers to said second plurality of capacitive couplers, and a plurality of receivers, each of which demodulates a respective one of said modulated signals and provides said demodulated signal to said second IC location. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of conveying a signal from a first integrated circuit (IC) location to a second IC location, comprising:
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modulating said signal from said first IC location, capacitively coupling said modulated signal to a wireless transmission medium, propagating said capacitively coupled modulated signal through said wireless transmission medium, capacitively coupling said propagated modulated signal from said wireless transmission medium, demodulating said modulated signal capacitively coupled from said wireless transmission medium and providing said demodulated signal to said second IC location. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 29, 30, 31, 32, 33, 34)
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28. A method of conveying a plurality of signals from respective first integrated circuit (IC) locations to respective second IC locations, comprising:
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modulating each of said signals from said first IC locations, capacitively coupling each of said modulated signals to a wireless transmission medium, propagating said capacitively coupled modulated signals through said wireless transmission medium, capacitively coupling said propagated modulated signals from said wireless transmission medium, demodulating each of said modulated signals capacitively coupled from said wireless transmission medium and providing said demodulated signals to said second IC locations.
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Specification