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Light-emitting diode (LED) package and packaging method for shaping the external light intensity distribution

  • US 20020185651A1
  • Filed: 06/08/2001
  • Published: 12/12/2002
  • Est. Priority Date: 06/08/2001
  • Status: Active Grant
First Claim
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1. A light emitting diode (LED) package, comprising:

  • a transparent encapsulant surrounding the LED die; and

    a reflective surface disposed on the encapsulant surface essentially opposite the LED die surface.

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  • 4 Assignments
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