IC package with dual heat spreaders

• US 20020185727A1
• Filed: 08/14/2002
• Published: 12/12/2002
• Est. Priority Date: 09/01/1998
• Status: Active Grant

• Current Assignee: David J. Corisis
• Original Assignee: David J. Corisis
• Inventors: Corisis, David J.
• Granted Patent: US 6,765,291 B2
• Time in Patent Office: Days
• US Class Current: 257/707
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48095 Kinked
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49568 specifically adapted to facilitate heat dissipation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/585 comprising conductive layers or plates or strips or rods or rings H01L23/60, H01L23/62, H01L23/64, H01L23/66 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10T 29/49121 : Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49147 : Assembling terminal to base
• CPC Class Codes: Y10T 29/49169 : Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49171 : with encapsulating
• CPC Class Codes: Y10T 29/49172 : by molding of insulating material
• CPC Class Codes: Y10T 29/49174 : Assembling terminal to elongated conductor

Abstract

An integrated circuit device has a heat spreader attached to each of the major outer encapsulant surfaces. One or both of the heat spreaders has a pair of end posts configured for insertion into through-holes in a substrate to position and support the device during and following the outer lead solder reflow step at board assembly. The heat spreaders provide high heat dissipation and EMR shielding, and may be connected to the substrate ground to become ground planes.

Claims

1. A semiconductor device package, comprising:

a semiconductor die having electrical leads connected thereto, said semiconductor die encapsulated in a material forming a package, said package having opposing major external surfaces and having a package edge connecting said opposing major external surfaces and a portion of said electrical leads connected to said semiconductor die extending from said package edge, lead ends of said portion of electrical leads for connection to a substrate, said package configured with register apparatus comprising a recess in at least one peripheral edge of said package, said recess extending to each of said opposing major external surfaces, said electrical leads for vertical mounting of said semiconductor die on said substrate; and

two heat spreaders, each of said two heat spreaders contacting at least a portion of said substrate, said two heat spreaders having a portion thereof attached to a portion of one of said opposing major external surfaces of said semiconductor die, thereby containing said semiconductor die between a portion of said two heat spreaders, said two heat spreaders configured to provide essentially a sole structural support for at least one of said electrical leads, said two heat spreaders positioned so as to provide an opening between distal end portions of said two heat spreaders, said two heat spreaders comprising register apparatus on at least one peripheral edge of said two heat spreaders for alignment with the register apparatus of said package.

2. The semiconductor device package of claim 1, wherein at least one of said two heat spreaders has at least one through-hole post extending outwardly beyond said lead ends for connection to said substrate.

3. The semiconductor device package of claim 2, wherein one of said two heat spreaders has a through-hole post proximate each end of said semiconductor die for connection to said substrate, said substrate having apertures therein.

4. The semiconductor device package of claim 2, wherein a first heat spreader has at least one post proximate a first end of said semiconductor die, and a second heat spreader has at least one post proximate a second, opposite end of said semiconductor die.

5. The semiconductor device package of claim 1, wherein each of said two heat spreaders substantially covers the attached portion of one of said opposing major external surfaces of said semiconductor die.

6. The semiconductor device package of claim 1, wherein at least one of said two heat spreaders includes use for connecting to a ground conductor on said substrate.

7. The semiconductor device package of claim 1, wherein said semiconductor die comprises a vertical mount plastic-encapsulated package.

8. The semiconductor device package of claim 1, wherein said register apparatus on said at least one peripheral edge of each of said two heat spreaders includes use for machine positioning and attachment of each heat spreader on one of said opposing major external surfaces of said package.

9. The semiconductor device package of claim 8, wherein said register apparatus on said at least one peripheral edge of each of said two heat spreaders comprises cutout portions of each of said two heat spreaders.

10. The semiconductor device package of claim 1, wherein said two heat spreaders are attached to said package with an adhesive.

11. The semiconductor device package of claim 1, wherein said two heat spreaders are attached to said package with an adhesive-coated tape.

12. The semiconductor device package of claim 1, wherein said two heat spreaders comprise plates, said plates including metal, ceramic material, and plastic material.

13. The semiconductor device package of claim 1, further comprising:

a second layer of material encapsulating said two heat spreaders within said package.

15. The semiconductor device of claim 14, wherein at least one of said two heat spreaders has at least one post extending beyond said lead ends for attachment to said substrate.

16. The semiconductor device of claim 15, wherein one of said two heat spreaders has a post proximate each end of said semiconductor die.

17. The semiconductor device of claim 15, wherein a first heat spreader of said two heat spreaders has at least one post proximate a first end of said semiconductor die, and a second heat spreader of said two heat spreaders has at least one post proximate a second, opposite end of said semiconductor die.

18. The semiconductor device of claim 14, wherein each of said two heat spreaders substantially covers one of the attached two opposing major external surfaces of said package.

19. The semiconductor device of claim 14, wherein at least one of said two heat spreaders is configured for attachment to a conductor on said substrate.

20. The semiconductor device of claim 14, wherein said semiconductor die comprises a vertical mount plastic-encapsulated package.

21. The semiconductor device of claim 14, wherein said register apparatus on said at least one peripheral edge of each of said two heat spreaders are configured for machine positioning and attachment of each heat spreader on one of said two opposing major external surfaces.

22. The semiconductor device of claim 21, wherein said register apparatus comprises cutout portions of each of said heat spreaders.

23. The semiconductor device of claim 14, wherein said two heat spreaders are attached to said package with an adhesive.

24. The semiconductor device of claim 14, wherein said two heat spreaders are attached to said package with an adhesive-coated tape.

25. The semiconductor device of claim 14, wherein said two heat spreaders comprise plates, said plates including metal, ceramic material, and plastic material.

26. The semiconductor device of claim 14, further comprising:

a second layer of material encapsulating said two heat spreaders within said package.

28. The vertical mount semiconductor package of claim 27, wherein said heat spreaders are secured to said material encapsulating at least the opposed major surfaces of said semiconductor die.

29. The vertical mount semiconductor package of claim 27, wherein said heat spreaders are adhesively secured to said material encapsulating said portions of said semiconductor die.

30. The vertical mount semiconductor package of claim 27, wherein said heat spreaders are secured to said material encapsulating said portions of said semiconductor die by an adhesive-coated tape.

31. The vertical mount semiconductor package of claim 27, further comprising:

a second layer of material covering a portion of said heat spreaders.

14. A semiconductor device, comprising:

a semiconductor die encapsulated in material forming a package having two opposing major external surfaces and having a package edge connecting said two opposing major external surfaces and electrical leads extending therefrom, said lead ends of said electrical leads are for attachment to a substrate, said electrical leads for vertical mounting of said semiconductor die on said substrate, said package having register apparatus comprising a recess in at least one peripheral edge of said package, said recess extending to each of said two opposing major external surfaces; and

two heat spreaders, each heat spreader having a surface attached to one of said two opposing major external surfaces of said package, said each heat spreader contacting at least a portion of said substrate, said package sandwiched between said two heat spreaders, said two heat spreaders configured to provide essentially the sole structural support for at least one of said electrical leads, said two heat spreaders positioned so as to provide an opening between end portions of said two heat spreaders, said two heat spreaders comprising register apparatus on at least one peripheral edge of said two heat spreaders for alignment with the register apparatus of said package.

27. A vertical mount semiconductor package, comprising:

a semiconductor die having opposed major surfaces and circuits formed on one of said opposed major surfaces;

a die support member attached to the other of said opposed major surfaces of said semiconductor die;

conductive outer leads along one edge of said semiconductor die between said opposed major surfaces for attachment to a substrate;

conductive lead members connecting said circuits to said conductive outer leads;

a material encapsulating portions of said semiconductor die, said die support member, and said conductive lead members, said material forming a package, said package having register apparatus comprising a recess in at least one peripheral edge of said package, said recess extending to each of said opposed major surfaces; and

thermally conductive plates comprising heat spreaders attached to said material being secured thereto, each of said thermally conductive plates contacting at least a portion of said substrate, each of said thermally conductive plate covering a portion of said material encapsulating said portions of said semiconductor die and configured to provide essentially a sole structural support for at least one of said conductive outer leads, said heat spreaders positioned so as to provide an opening between distal end portions of said heat spreaders, said heat spreaders comprising register apparatus on at least one peripheral edge of each of said heat spreaders for alignment with the register apparatus of said package and for machine positioning and attachment of said heat spreaders on said opposed major surfaces of said package.

32. A vertical mount semiconductor package, comprising:

a semiconductor die having opposed major surfaces and circuits formed on one of said opposed major surfaces;

a die support member attached to the other of said opposed major surfaces of said semiconductor die;

conductive outer leads along one edge of said semiconductor die between said opposed major surfaces for attachment to a substrate;

conductive lead members connecting said circuits to said conductive outer leads;

material encapsulating said semiconductor die, said die support member and said conductive lead members, said material forming a package, said package having a recess in at least one peripheral edge of said package for a register, said recess extending to each of said opposed major surfaces; and

thermally conductive plates comprising heat spreaders attached and secured to portion of said material encapsulating said semiconductor die and substantially covering said opposed major surfaces of said semiconductor die, said heat spreaders configured to provide essentially a sole structural support for at least one of said conductive outer leads, said heat spreaders positioned so as to provide an opening between distal end portions of said heat spreaders, said heat spreaders comprising register apparatus on at least one peripheral edge of each of said heat spreaders for alignment with the register apparatus of said package.

33. The vertical mount semiconductor package of claim 32, wherein said heat spreaders are secured to said material encapsulating said opposed major sides of said semiconductor die.

34. The vertical mount semiconductor package of claim 32, wherein said heat spreaders are secured to said material encapsulating said semiconductor die by an adhesive material.

35. The vertical mount semiconductor package of claim 32, wherein said heat spreaders are secured to said material encapsulating said semiconductor die by an adhesive-coated tape.

36. The vertical mount semiconductor package of claim 32, further comprising:

a second layer of material securing said heat spreaders to said material encapsulating said semiconductor die.

38. The heat spreader apparatus of claim 37, wherein said first heat spreader and said second heat spreader are identical in shape for inverse attachment to said at least two opposed major surfaces.

39. The heat spreader apparatus of claim 38, wherein said at least one post is positioned adjacent one end on each of said first heat spreader and said second heat spreader.

40. The heat spreader apparatus of claim 38, wherein said first heat spreader has two posts projecting therefrom and said second heat spreader has no through-hole posts.

41. The heat spreader apparatus of claim 37, wherein said plates are comprised of metal, a metal filled polymer material, and a ceramic material.

42. The heat spreader apparatus of claim 37, wherein said register apparatus on said at least one peripheral edge of each of said first heat spreader and said second heat spreader are configured for machine positioning and attachment to one of said at least two opposed major surfaces.

37. A heat spreader apparatus for an encapsulated semiconductor device having a row of exterior leads, a peripheral edge and at least two opposed major surfaces, the encapsulated semiconductor device having a register apparatus in the peripheral edge thereof, comprising:

a plate forming a first heat spreader for covering a portion of one of said at least two opposed major surfaces of said encapsulated semiconductor device, said first heat spreader having a lead edge proximate to said row of exterior leads having at least one post projecting therefrom for securing said encapsulated semiconductor device to a substrate having at least one circuit thereon said first heat spreader comprising register apparatus on at least one peripheral edge thereof for accurate mounting to one of said at least two opposed major surfaces; and

another plate forming a second heat spreader for covering a portion of a second one of said at least two opposed major surfaces of said encapsulated semiconductor device, said second heat spreader having a lead edge proximate to said row of exterior leads having at least one post projecting therefrom for securing said encapsulated semiconductor device to said substrate having said at least one circuit thereon, said second heat spreader comprising register apparatus on at least one peripheral edge thereof for accurate mounting to said portion of second one of said at least two opposed major surfaces, each of said register apparatus of said first heat spreader and said second heat spreader aligned with the register apparatus of the encapsulated semiconductor device to form a recess extending into said at least two opposed major surfaces and each of said first heat spreader and said second heat spreader, said first heat spreader and said second heat spreader for providing essentially a sole structural support for at least one of said row of exterior leads, said first heat spreader and said second heat spreader are positioned so as to provide an opening between distal end portions of said first heat spreader and said second heat spreader and said at least one post aligning said row of exterior leads with said at least one circuit on said substrate.

43. A heat spreader apparatus for an encapsulated semiconductor device having a row of exterior leads, a peripheral edge and two opposed major surfaces, the encapsulated semiconductor device having a register apparatus in the peripheral edge thereof, comprising:

a plate of heat conductive material cut to form two heat spreaders for substantially covering each of said two opposed major surfaces of said encapsulated semiconductor device, each of said two heat spreaders having a lead edge proximate to said row of exterior leads, said two heat spreaders having at least two posts projecting therefrom for attachment to a substrate and aligning said row of exterior leads with respect to said substrate, said two heat spreaders configured to provide essentially the sole structural support for at least one of said row of exterior leads, said two heat spreaders comprising register apparatus on at least one peripheral edge thereof for accurate mounting to said two opposed major surfaces, each of said register apparatus of said two heat spreaders aligned with the register apparatus of the encapsulated semiconductor device to form a recess extending into the two opposed major surfaces and each of said two heat spreaders, said two heat spreaders positioned for providing an opening therebetween.

44. The heat spreader apparatus of claim 43, wherein each of said two heat spreaders has two posts projecting therefrom.

45. The heat spreader apparatus of claim 43, wherein each of said two heat spreaders has one post projecting therefrom.

46. The heat spreader apparatus of claim 44, wherein each of said two heat spreaders is similar in shape for inverse attachment to one of said two opposed major surfaces.

47. The heat spreader apparatus of claim 43, wherein one of said at least two posts is positioned adjacent an end of said two heat spreaders.

48. The heat spreader apparatus of claim 43, wherein one of said two heat spreaders has two posts projecting therefrom and the other of said two heat spreaders has no through-hole posts.

49. The heat spreader apparatus of claim 43, wherein said plate comprises one of metal, metal filled polymer material, and ceramic material.

50. The heat spreader apparatus of claim 43, wherein said register apparatus formed on each of said two heat spreaders are configured for machine positioning and attachment of said two heat spreaders to said two opposed major surfaces.

51. A semiconductor device package, comprising:

a semiconductor die having electrical leads connected thereto, said semiconductor die encapsulated in a material forming a package, said package having opposing major external surfaces and having four minor edge surfaces connecting said opposing major external surfaces, said package configured with register apparatus comprising a recess in at least one peripheral edge of said package, said recess extending to each of said opposing major external surfaces;

a portion of the electrical leads connected to said semiconductor die extending from one of said four minor edge surfaces, lead ends of said portion of the electrical leads being configured for connection to a substrate, said electrical leads for vertical mounting of said semiconductor die on said substrate, and at least one of said two heat spreaders has at least one through-hole post extending outwardly beyond said lead ends for connection to said substrate, said four minor edge surfaces having no heat dissipating structures;

two heat spreaders, each heat spreader having a portion thereof attached to a portion of one of said opposing major external surfaces of said semiconductor die thereby containing said semiconductor die between a portion of said two heat spreaders, said two heat spreaders configured to provide essentially a sole structural support for at least one of said electrical leads, said two heat spreaders positioned so as to provide an opening between distal end portions of said two heat spreaders, said two heat spreaders comprising register apparatus on at least one peripheral edge of each of said heat spreaders for alignment with the register apparatus of said package.

52. The semiconductor device package of claim 51, wherein one of said two heat spreaders has a through-hole post proximate each end of said semiconductor die for connection to said substrate, said substrate having apertures therein.

53. The semiconductor device package of claim 51, wherein a first heat spreader has at least one post proximate a first end of said semiconductor die, and a second heat spreader has at least one post proximate a second, opposite end of said semiconductor die.

54. The semiconductor device package of claim 53, wherein each of said two heat spreaders substantially covers the attached portion of one of said opposing major external surfaces of said semiconductor die.

55. The semiconductor device package of claim 54, wherein at least one of said two heat spreaders is configured for connection to a ground conductor on said substrate.

56. The semiconductor device package of claim 55, wherein said semiconductor die comprises a vertical mount plastic-encapsulated package.

57. The semiconductor device package of claim 56, wherein said register apparatus on at least one peripheral edge of each of said two heat spreaders are configured for machine positioning and attachment of each heat spreader on one of said opposing major external surfaces of said package.

58. The semiconductor device package of claim 57, wherein said register apparatus on a peripheral edge of each of said two heat spreaders comprises cutout portions of each of said two heat spreaders.

59. The semiconductor device package of claim 58, wherein said two heat spreaders are attached to said package with an adhesive.

60. The semiconductor device package of claim 51, wherein said two heat spreaders are attached to said package with an adhesive-coated tape.

61. The semiconductor device package of claim 51, wherein said two heat spreaders comprise plates, said plates including metal, ceramic material, and plastic material.

62. The semiconductor device package of claim 51, further comprising:

a second layer of material encapsulating said two heat spreaders within said package.