Light emitting device and manufacturing method thereof

• US 20020185966A1
• Filed: 06/10/2002
• Published: 12/12/2002
• Est. Priority Date: 06/11/2001
• Status: Active Grant

• Current Assignee: Citizen Electronics Company Limited
• Original Assignee: Citizen Electronics Company Limited
• Inventors: Murano, Yoshio
• Granted Patent: US 6,707,247 B2
• Time in Patent Office: Days
• US Class Current: 313/501
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/10329 Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/12036 PN diode
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2933/0041 : relating to wavelength conversion elements
• CPC Class Codes: H01L 33/505 : characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements
• CPC Class Codes: H01L 33/60 : Reflective elements

Abstract

A light emitting device has a substrate, an LED mounted on the substrate. A first transparent layer seals the LED, and a second transparent layer is provided around the first transparent layer. Particles of fluorescent material are included in the second transparent layer. A reflector layer is formed on outside walls except an upper side.

Claims

1. A light emitting device comprising:

a substrate;

an LED mounted on the substrate;

a first transparent layer sealing the LED;

a second transparent layer provided around the first transparent layer;

fluorescent material being included in either of the first transparent layer and the second transparent layer; and

a reflector layer formed on outside walls except an upper side.

2. The light emitting device according to claim 1 wherein a coloring agent is included in either of the first and second transparent layers.

3. The light emitting device according to claim 1 wherein fluorescent material and a coloring agent are included in either of the first and second transparent layers.

4. The light emitting device according to claim 1 wherein the second transparent layer has an inverted trapezoid shape in section.

5. A method for manufacturing a light emitting device, comprising the steps of:

preparing a substrate aggregation having a plurality of substrate divisions;

mounting an LED on the substrate division;

forming a first transparent layer on the substrate aggregation;

cutting off the first transparent layer at division lines surrounding the substrate division to form an individual first transparent layer;

forming a second transparent layer on the individual first transparent layer;

cutting off the second transparent layer at division lines surrounding the substrate division to form an individual second transparent layer;

forming a reflector film on outside walls of the individual second transparent layer; and

dividing the substrate division at division lines of the division.

6. The method according to claim 5 further comprising providing a substrate attachment between adjacent substrate divisions, and cutting off the substrate attachment and the second transparent layer in an inverted V-shape in section.

7. The method according to claim 5 further comprising mixing fluorescent material in either of the first transparent layer and the second transparent layer.

8. The method according to claim 5 further comprising mixing coloring agent in either of the first and second transparent layers.

9. The method according to claim 5 further comprising mixing fluorescent material and a coloring agent in either of the first and second transparent layers.