Layered product and capacitor

• US 20020186522A1
• Filed: 05/01/2002
• Published: 12/12/2002
• Est. Priority Date: 11/18/1997
• Status: Active Grant

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Odagiri, Masaru, Honda, Kazuyoshi, Echigo, Noriyasu, Sunagare, Nobuki, Suzawa, Shinichi
• Granted Patent: US 6,611,420 B2
• Time in Patent Office: Days
• US Class Current: 361/311
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence

Abstract

A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 μm or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 μm or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.

Claims

1. A layered product comprising a plurality of deposition units, each of which includes a resin thin film layer and a metal thin film layer, wherein a surface roughness of the resin thin film layer is not more than 0.1 μ

m.

4. The layered product according to any one of claims 1 to 3, wherein a thickness of the resin thin film layer is not more than 1 μ

m.

5. The layered product according to any one of claims 1 to 3, wherein a thickness of the resin thin film layer is not more than 0.7 μ

m.

6. The layered product according to any one of claims 1 to 3, wherein a thickness of the metal thin film layer is not more than 100 μ

m.

7. The layered product according to any one of claims 1 to 3, wherein a film resistance of the metal thin film layer is not less than 2Ω

/□

.

8. The layered product according to any one of claims 1 to 3, wherein (a thickness of the resin thin film layer)/(a thickness of the metal thin film layer)≦

20.

9. The layered product according to any one of claims 1 to 3, wherein the metal thin film layer comprises aluminum, copper, zinc, nickel, a compound thereof, an oxide thereof, or an oxide of a compound thereof.

10. The layered product according to any one of claims 1 to 3, wherein the metal thin film layer is separated into at least 2 metal thin film layers by a belt-shaped electrically insulating portion that is present on the resin thin film layer.

11. The layered product according to any one of claims 1 to 3, wherein the metal thin film layer is deposited in a portion except a belt-shaped electrically insulating portion that is present on one end of the resin thin film layer.

12. The layered product according to any one of claims 1 to 3, wherein a reinforcement layer comprising a plurality of deposition units, each of which includes a resin layer and a metal layer deposited on one surface of the resin layer is deposited on at least one side.

13. The layered product according to claim 12, wherein the metal layer is deposited in a portion except a belt-shaped electrically insulating band that is present on one end of the resin layer.

14. The layered product according to claim 12, wherein a material of the resin layer is different from that of the resin thin film layer.

15. The layered product according to claim 12, wherein a thickness of the resin layer is larger than that of the resin thin film layer.

16. The layered product according to claim 12, wherein a thickness of the metal layer is larger than that of the metal thin film layer.

17. The layered product according to any one of claims 1 to 3, wherein a protective layer is deposited on at least one side.

18. The layered product according to claim 17, wherein a material of the protective layer is different from that of the resin thin film layer.

19. The layered product according to claim 17, wherein the protective layer is colored.

20. The layered product according to claim 17, wherein the protective layer is transparent.

21. The layered product according to any one of claims 1 to 3, wherein external electrodes are formed on sides of the layered product that are opposed to each other.

22. The layered product according to claim 21, wherein the external electrodes comprise a plurality of layers.

23. A capacitor produced using the layered product according to any one of claims 1 to 3.

25. The layered product according to claim 24, wherein a thickness of the metal thin film layer is different from that of the metal layer.

26. The layered product according to claim 24, wherein a thickness of the dielectric layer is different from that of the resin layer.

28. The layered product according to claim 24 or 27, wherein the element layer satisfies A, and deposition positions of electrically insulating portions of every other deposition unit of the element layer are not the same position over the element layer.

29. The layered product according to claim 24 or 27, wherein the element layer satisfies B, and widths of electrically insulating portions of every other deposition unit of the element layer are not the same width over the element layer.

30. The layered product according to claim 24 or 27, wherein the number of the deposition unit of the element layer is at least 100.

31. The layered product according to claim 24 or 27, wherein a thickness of the dielectric layer is not more than 1 μ

m.

32. The layered product according to claim 24 or 27, wherein a thickness of the dielectric layer is not more than 0.7 μ

m.

33. The layered product according to claim 24 or 27, wherein a film resistance of the metal thin film layer is not less than 2Ω

/□

.

34. The layered product according to claim 24 or 27, wherein (a thickness of the dielectric layer)/(a thickness of the metal thin film layer)≦

20.

35. The layered product according to claim 24 or 27, wherein a curing degree of the dielectric layer is 50 to 95%.

36. The layered product according to claim 24 or 27, wherein the metal thin film layer comprises aluminum or an oxide thereof.

37. The layered product according to claim 24 or 27, wherein the reinforcement layer comprises a plurality of deposition units.

38. The layered product according to claim 24 or 27, wherein a thickness of the reinforcement layer (a thickness of one of the reinforcement layers deposited on both sides) is not less than 20 μ

m.

39. The layered product according to claim 24 or 27, wherein the reinforcement layer satisfies C, and the electrically insulating band is provided substantially in a central portion of the layered product.

40. The layered product according to claim 37, wherein the reinforcement layer satisfies C, and deposition positions of the electrically insulating bands are not the same position over the reinforcement layer.

41. The layered product according to claim 37, wherein the reinforcement layer satisfies D, and widths of the electrically insulating bands are not the same width over the reinforcement layer.

42. The layered product according to claim 37, wherein the reinforcement layer satisfies D, and electrically insulating bands of adjacent deposition units of the reinforcement layer are deposited so as to be positioned on opposite sides.

43. The layered product according to claim 42, wherein widths of electrically insulating bands of every other deposition unit of the reinforcement layer are not the same width over the reinforcement layer.

44. The layered product according to claim 24 or 27, wherein a material of the resin layer is different from that of the dielectric layer.

45. The layered product according to claim 24 or 27, wherein a curing degree of the resin layer is 50 to 95%.

46. The layered product according to claim 24, wherein a thickness of the protective layer (a thickness of one of the protective layers-deposited on both sides) is not less than 2 μ

m.

47. The layered product according to claim 24, wherein a material of the protective layer is different from that of the dielectric layer.

48. The layered product according to claim 24, wherein a curing degree of the protective layer is 50 to 95%.

49. The layered product according to claim 24 or 27, wherein a thickness of the resin layer is larger than that of the dielectric layer.

50. The layered product according to claim 24 or 27, wherein a thickness of the metal layer is larger than that of the metal thin film layer.

51. The layered product according to claim 24 or 27, wherein external electrodes are formed on both sides that are opposed to each other of the layered product.

52. The layered product according to claim 51, wherein the external electrodes comprise a plurality of layers.

53. The layered product according to claim 52, wherein a layer of the external electrodes electrically connected to the metal thin film layer is formed by metal spraying.

54. The layered product according to claim 51, wherein a bump electrode is formed in the external electrodes.

55. The layered product according to claim 24 or 27, comprising an outer package on an outer surface.

56. A capacitor produced using the layered product according to claim 24 or 27.

57. The capacitor according to claim 56, which is a chip capacitor.

2. A layered product comprising a plurality of deposition units, each of which includes a resin thin film layer and a metal thin film layer, wherein the resin thin film layer contains no protrusion forming component.

3. A layered product comprising a plurality of deposition units, each of which includes a resin thin film layer and a metal thin film layer, wherein a surface roughness of the metal thin film layer is not more than 0.1 μ

m.

24. A layered product comprising an element layer, reinforcement layers deposited on both sides of the element layer, and protective layers deposited further on both sides of the reinforcement layers,

wherein the element layer satisfies A or B below, and the reinforcement layer satisfies C or D below:

A;

A plurality of deposition units, each of which comprises a dielectric layer, a first metal thin film layer and a second metal thin film layer that are deposited on one surface of the dielectric layer and separated by a belt-shaped electrically insulating portion, are deposited in such a manner that the electrically insulating portions of adjacent deposition units are deposited in different positions;

B;

A plurality of deposition units, each of which comprises a dielectric layer and a metal thin film layer that is deposited on one surface of the dielectric layer and in a portion except a belt-shaped electrically insulating portion on one end of the surface of the dielectric layer, are deposited in such a manner that the electrically insulating portions of adjacent deposition units are positioned in opposite sides;

C;

comprising a deposition unit that comprises a resin layer, a first metal layer and a second metal layer that are deposited on one surface of the resin layer and separated by a belt-shaped electrically insulating band; and

D;

comprising a deposition unit that comprises a resin layer and a metal layer that is deposited on one surface of the resin layer and in a portion except a belt-shaped electrically insulating band on one end of the surface of the resin layer.

27. A layered product comprising an element layer and reinforcement layers deposited on both sides of the element layer,

wherein the element layer satisfies A or B below, the reinforcement layer satisfies C or D below, and further at least one of E or F is satisfied:

A;

A plurality of deposition units, each of which comprises a dielectric layer, a first metal thin film layer and a second metal thin film layer that are deposited on one surface of the dielectric layer and separated by a belt-shaped electrically insulating portion, are deposited in such a manner that the electrically insulating portions of adjacent deposition units are deposited in different positions;

B;

A plurality of deposition units, each of which comprises a dielectric layer and a metal thin film layer that is deposited on one surface of the dielectric layer and in a portion except a belt-shaped electrically insulating portion on one end of the surface of the dielectric layer, are deposited in such a manner that the electrically insulating portions of adjacent deposition units are positioned on opposite sides;

C;

comprising a deposition unit that comprises a resin layer, a first metal layer and a second metal layer that are deposited on one surface of the resin layer and separated by a belt-shaped electrically insulating band;

D;

comprising a deposition unit that comprises a resin layer and a metal layer that is deposited on one surface of the resin layer and in a portion except a belt-shaped electrically insulating band on one end of the surface of the resin layer;

E;

The thickness of the dielectric layer is different from that of the resin layer;

F;

The thickness of the metal thin film layer is different from that of the metal layer.