Mobile computer system with detatchable thermoelectric module for enhanced cooling capability in a docking station

• US 20020186531A1
• Filed: 06/12/2001
• Published: 12/12/2002
• Est. Priority Date: 06/12/2001
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Chrysler, Gregory M., Pokharna, Himanshu
• Granted Patent: US 6,646,874 B2
• Time in Patent Office: Days
• US Class Current: 361/687
• CPC Class Codes: G06F 1/1632 External expansion units, e.g. docking stations
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops

Abstract

A computer system is described having additional cooling capabilities in a docking station for a mobile computer. The docking station includes P- and N-doped semiconductor thermoelectric components. The thermoelectric components are connected in series when the mobile computer engages with the docking station. A current flowing through a doped semiconductor causes heat to be transferred either in a direction of a current through the semiconductor component or in a direction opposite to a current in the thermoelectric components, depending on their doping. The thermoelectric components alternate from being P-doped to N-doped and the direction in which current flows alternates accordingly so that heat is transferred in one direction only. A heat pumping effect is created by the thermoelectric components which does not require high-pressure contact upon engagement of the mobile computer with the docking station.

Claims

1. A computer system comprising:

a mobile computer housing;

a logic processor mounted to the mobile computer housing;

a first thermoelectric plate mounted to the mobile computer housing and thermally connected to the logic processor;

a port station engager, the mobile computer housing being disengageable from and receivable by the port station engager;

a second thermoelectric plate mounted to the port station engager; and

a thermoelectric component, which thermally connects the thermoelectric plates to one another when the mobile computer housing is moved from being disengaged from to being received by the port station engager and being made of a material that transfers heat from the first thermoelectric plate to the second thermoelectric plate when current conducts therethrough.

2. The computer system of claim 1 wherein the thermoelectric component is mounted to the port station engager.

3. The computer system of claim 1 further comprising:

a plurality of thermoelectric components, each made of a semiconductor material and each thermally connecting the thermoelectric plates to one another when the mobile computer housing is received by the port station engager.

4. The computer system of claim 1 comprising:

a plurality of thermoelectric components, at least some of which are made of a semiconductor material;

a first set of electric links connecting first ends of pairs of thermoelectric components to one another when the mobile computer housing is disengaged from and when the mobile computer housing is received by the port station engager; and

a second set of electric links connecting respective pairs of thermoelectric components to one another when the mobile computer housing is moved from being disengaged from to being received by the port station engager so that a current can flow in series through thermoelectric components of one pair followed by the thermoelectric components of another pair.

5. The computer system of claim 1 wherein each set of links is mounted to a respective thermoelectric plate.

6. The computer system of claim 4 wherein each thermoelectric plate is thermally conductive and electrically insulating.

7. The computer system of claim 1 wherein the mobile computer housing and the port station engager have complementary interengageable formations.

8. The computer system of claim 1 further comprising:

a computer heat sink mounted to the port station engager and thermally connected to the second thermoelectric plate.

9. The computer system of claim 1 further comprising:

a port station fan mounted to the port station engager, rotation of the port station fan causing air to flow to accelerate cooling of the second thermoelectric plate.

10. The computer system of claim 1 further comprising:

a computer fan mounted to the mobile computer housing, rotation of the computer fan causing air to flow to accelerate cooling of the processor.

11. The computer system of claim 1 further comprising:

a screen mounted to the mobile computer housing; and

a set of alphanumeric keys mounted to the mobile computer housing.

13. The computer system of claim 12 wherein the mobile computer housing and the port station engager have complementary interengageable formations.

14. The computer system of claim 12 further comprising:

a computer heat sink mounted to the port station engager and thermally connected to the second thermoelectric plate.

15. The computer system of claim 12 further comprising:

a port station fan mounted to the port station engager, rotation of the port station fan causing air to flow to accelerate cooling of the second thermoelectric plate.

16. The computer system of claim 12 further comprising:

a computer fan mounted to the mobile computer housing, rotation of the computer fan causing air to flow to accelerate cooling of the processor.

17. The computer system of claim 12 further comprising:

a screen mounted to the mobile computer housing; and

a set of alphanumeric keys mounted to the mobile computer housing.

19. The method of claim 18 wherein, when engaging the housing with the port station engager, the processor is thermally coupled to the thermoelectric plate through a plurality of thermoelectric components located thermally in parallel.

20. The method of claim 19 wherein, when engaging the housing with the port station engager, the thermoelectric components are electrically connected to one another.

21. The method of claim 20 wherein, when engaging the housing with the port station engager, at least three thermoelectric components are connected electrically in series.

12. A computer system comprising:

a port station engager;

a first thermally conductive and electrically insulating thermoelectric plate secured to the port station engager;

a first set of links secured to the first thermoelectric plate;

a plurality of thermoelectric components, each link of the first set having a respective pair of the thermoelectric components secured thereto;

a mobile computer housing disengageable from and receivable by the port station engager;

a logic processor mounted to the mobile computer housing;

a second thermally conductive and electrically insulating thermoelectric plate secured to the mobile computer housing and thermally connected to the processor;

a second set of links secured to the second thermoelectric plate, each connecting a thermoelectric component of one of the pairs with a thermoelectric component of another one of the pairs when the mobile computer housing is moved from being disengaged from to being received by the port station engager.

18. A method of cooling a logic processor of a mobile computer comprising:

engaging a mobile computer housing with a port station engager thereby thermally coupling the processor to a thermoelectric plate mounted to the port station engager through a thermoelectric component; and

conducting current through the thermoelectric component.