Ultrasonically sealing the cover plate to provide a hermetic enclosure for OLED displays

• US 20020187254A1
• Filed: 05/08/2001
• Published: 12/12/2002
• Est. Priority Date: 05/08/2001
• Status: Active Grant

• Current Assignee: Global OLED Technology LLC (LG Display Co., Ltd.)
• Original Assignee: Eastman Kodak Company
• Inventors: Ghosh, Syamal K., Moore, Harold, He, Fugui
• Granted Patent: US 6,706,316 B2
• Time in Patent Office: Days
• US Class Current: 427/58
• CPC Class Codes: H10K 50/8423 Metallic sealing arrangements
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8721 Metallic sealing arrangements
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

A method of providing a hermetically sealed enclosure for a highly moisture sensitive electronic device including depositing an electrical conductor on the substrate which provides an electrical connection with the electronic device and depositing an electrically insulating thin layer over the electrical conductor; providing a low melting point indium metal or alloy in the form of a wire having diameter ranging from 1 mil to 10 mils on the electrically insulating thin layer on the substrate so that the wire is situated around the periphery of the electronic device; placing an ultrasonic horn over the cover plate so that ultrasonic energy can be delivered through the cover plate to the wire and applying a pressure between 20 and 100 psi; and providing an acoustic wave to melt the wire.

Claims

1. A method of providing a hermetically sealed enclosure for a highly moisture sensitive electronic device comprising the steps of:

(a) depositing an electrical conductor on the substrate which provides an electrical connection with the electronic device and depositing an electrically insulating thin layer over the electrical conductor;

(b) providing a low melting point indium metal or alloy in the form of a wire having diameter ranging from 1 mil to 10 mils on the electrically insulating thin layer on the substrate so that the wire is situated around the periphery of the electronic device;

(c) placing an ultrasonic horn over the cover plate so that ultrasonic energy can be delivered through the cover plate to the wire and applying a pressure between 20 and 100 psi; and

(d) providing an acoustic wave from the ultrasonic horn through the cover plate to melt the wire.

2. A method of sealing a cover plate to a substrate to provide an enclosure for a highly moisture sensitive electronic device, comprising the steps of:

(a) depositing an electrical conductor on the substrate which provides an electrical connection with the electronic device and depositing an electrically insulating thin layer over the electrical conductor;

(b) providing a low melting point indium metal or alloy in the form of a wire having diameter ranging from 1 mil to 10 mils on the electrically insulating thin layer on the substrate so that the wire is situated around the periphery of the electronic device;

(c) placing a cover plate in contact with the wire so that the cover plate encloses the electronic device;

(d) placing an ultrasonic horn over the cover plate so that ultrasonic energy can be delivered through the cover plate to the wire and applying a pressure between 20 and 100 psi; and

(e) providing an acoustic wave from the ultrasonic horn having acoustic energy of 10 to 100 kHz for 1 to 15 seconds which is transmitted through the cover plate to the wire so that the wire melts and hermetically bonds the cover plate to the substrate and the electrically insulating thin layer.

3. The method of claim 2 further including the step of:

(f) cooling the melted wire 5 to 20 seconds.

4. The method of claim 2 further including providing a desiccant in the enclosed space between the cover plate and electronic device.

5. The method of claim 2 wherein the device is an OLED display.

6. The method of claim 2 wherein the cover plate is made of glass.