Structure and method for fabricating semiconductor structures and devices for detecting smoke

• US 20020190232A1
• Filed: 06/18/2001
• Published: 12/19/2002
• Est. Priority Date: 06/18/2001
• Status: Abandoned Application

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Chason, Marc Kenneth
• Application Number:
  US09/882,067
• Publication Number:
  US 20020190232A1
• Time in Patent Office: Days
• US Class Current: 250/574
• CPC Class Codes: G01N 21/53 within a flowing fluid, e.g. smoke
• CPC Class Codes: G01N 21/8422 Investigating thin films, e.g. matrix isolation method
• CPC Class Codes: G08B 17/103 using a light emitting and receiving device
• CPC Class Codes: H01L 21/02381 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/02488 Insulating materials
• CPC Class Codes: H01L 21/02505 consisting of more than two layers
• CPC Class Codes: H01L 21/02513 Microstructure
• CPC Class Codes: H01L 21/02521 Materials

Abstract

High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. In addition, formation of a compliant substrate may include utilizing surfactant enhanced epitaxy, epitaxial growth of single crystal silicon onto single crystal oxide, and epitaxial growth of Zintl phase materials.

Claims

1. A semiconductor structure for detecting smoke comprising:

a monocrystalline silicon substrate;

an amorphous oxide material overlying the monocrystalline silicon substrate;

a monocrystalline perovskite oxide material overlying the amorphous oxide material;

a monocrystalline compound semiconductor material overlying the monocrystalline perovskite oxide material;

an optical source component overlying the monocrystalline compound semiconductor material, the optical source component being operable to generate a radiant energy transmission; and

an optical detector component overlying the monocrystalline compound semiconductor material, the optical detector component being operable to generate a detection signal in response to receipt of a reflection of the radiant energy transmission off of smoke particles.

2. The semiconductor structure of claim 1, wherein the optical source component is one of a group III-V compound semiconductor laser and a light emitting diode (LED).

3. The semiconductor structure of claim 2, wherein the group III-V compound semiconductor laser is one of a gallium arsenide (GaAs) laser, an aluminum gallium arsenide (AlGaAs) laser, an indium phosphide (InP) laser, and an indium gallium arsenide (InGaAs) laser.

4. The semiconductor structure of claim 1, wherein the optical detector component is one of a photodetector and a photoelectric detector.

5. The semiconductor structure of claim 4, wherein the photodetector is one of a photodiode and a phototransistor.

6. The semiconductor structure of claim 4, wherein the photoelectric detector comprises a group III-V compound semiconductor detector.

7. The semiconductor structure of claim 6, wherein the group III-V compound semiconductor detector is one of a gallium arsenide (GaAs) detector, an aluminum gallium arsenide (AlGaAs) detector, an indium phosphide (InP) detector, and an indium gallium arsenide (InGaAs) detector.

8. The semiconductor structure of claim 1, wherein the optical detector component is formed adjacent to the optical source component.

9. The semiconductor structure of claim 1, wherein the optical detector component comprises an optical detector component having an annular-shape, and wherein the optical detector component surrounds the optical source component.

10. The semiconductor structure of claim 1, wherein the radiant energy transmission is one of an ultraviolet transmission, an infrared transmission, and a beam of visible light.

11. The semiconductor structure of claim 1, wherein the optical detector component comprises an optical detector component being operable to generate the detection signal in response to a transmission value exceeding a threshold value, and wherein the transmission value is associated with the reflection of the radiant energy transmission.

12. The semiconductor structure of claim 1, wherein the threshold value is one of a current value and a voltage value.

13. The semiconductor structure of claim 1 further comprising an indicator, wherein the indicator generates light in response to the detection signal.

14. The semiconductor structure of claim 13, wherein the indicator generates sound in response to the detection signal.

16. The process of claim 15, wherein the optical source component is one of a group III-V compound semiconductor laser and a light emitting diode (LED).

17. The process of claim 16, wherein the group III-V compound semiconductor laser is one of a includes a gallium arsenide (GaAs) laser, an aluminum gallium arsenide (AlGaAs) laser, an indium phosphide (InP) laser, and an indium gallium arsenide (InGaAs) laser.

18. The process of claim 15, wherein the optical detector component is one of a photodetector and a photoelectric detector.

19. The process of claim 18, wherein the photodetector is one of a photodiode and a phototransistor.

20. The process of claim 15, wherein the photoelectric detector comprises a group III-V compound semiconductor detector.

21. The process of claim 20, wherein the group III-V compound semiconductor detector is one of a gallium arsenide (GaAs) detector, an aluminum gallium arsenide (AlGaAs) detector, an indium phosphide (InP) detector, and an indium gallium arsenide (InGaAs) detector.

22. The process of claim 15, wherein forming the optical detector component comprises forming the optical detector component adjacent to the optical source component.

23. The process of claim 15, wherein forming the optical detector component comprises forming an optical detector component having an annular shape, and wherein the optical detector component surrounds the optical source component.

24. The process of claim 15, wherein forming the optical detector component comprises forming an optical detector component operable to generate a detection signal in response to a transmission value exceeding a threshold value, and wherein the transmission value is associated with the reflection of the radiant energy transmission.

25. The process of claim 24, wherein the threshold value is one of a current value and a voltage value.

26. The process of claim 15, wherein the radiant energy transmission is one of an ultraviolet transmission, an infrared transmission, and a beam of visible light.

28. The method of claim 27, wherein generating a detection signal comprises generating a detection signal in response to a transmission value exceeding a threshold value, and wherein the transmission value is associated with the reflection of the radiant energy transmission.

29. The method of claim 28, wherein the predetermined threshold parameter is one of a current value and a voltage value.

30. The method of claim 27, wherein the radiant energy transmission is one of an ultraviolet transmission, an infrared transmission, and a beam of visible light.

15. A process for fabricating a semiconductor structure for detecting smoke comprising:

providing a monocrystalline silicon substrate;

depositing a monocrystalline perovskite oxide film overlying the monocrystalline silicon substrate, the film having a thickness less than a thickness of the material that would result in strain-induced defects;

forming an amorphous oxide interface layer containing at least silicon and oxygen at an interface between the monocrystallie perovskite oxide film and the monocrystalline silicon substrate;

epitaxially forming a monocrystalline compound semiconductor layer overlying the monocrystalline perovskite oxide film;

forming an optical source component overlying the monocrystalline compound semiconductor layer, the optical source component being operable to generate a radiant energy transmission; and

forming an optical detector component overlying the monocrystalline compound semiconductor layer, the optical detector component being operable to generate a detection signal in response to receipt of a reflection of the radiant energy transmission off of smoke particles.

27. A method for detecting smoke comprising:

providing a monocrystalline silicon substrate;

depositing a monocrystalline perovskite oxide film overlying the monocrystalline silicon substrate, the film having a thickness less than a thickness of the material that would result in strain-induced defects;

forming an amorphous oxide interface layer containing at least silicon and oxygen at an interface between the monocrystalline perovskite oxide film and the monocrystalline silicon substrate;

epitaxially forming a monocrystalline compound semiconductor layer overlying the monocrystalline perovskite oxide film;

generating a radiant energy transmission;

receiving a reflection of the radiant energy transmission off of smoke particles; and

generating a detection signal in response to receipt of the reflection of the radiant energy transmission.