Composition, use of composition and electronic devices

• US 20020190242A1
• Filed: 05/29/2001
• Published: 12/19/2002
• Est. Priority Date: 05/29/2001
• Status: Abandoned Application

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: lillie, Terence J., van der Veeken, Egidius H.J.
• Application Number:
  US09/866,810
• Publication Number:
  US 20020190242A1
• Time in Patent Office: Days
• US Class Current: 252/500
• CPC Class Codes: H05K 9/0083 comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers H05K9/0086 takes precedence

Abstract

Compositions comprising at least one thermoplastic polymer or copolymer and 0.1-5% by weight of metal coated glass flakes. The compositions can be used for the manufacture of the housing of electronic devices. Electronic devices with a housing made out of the composition of the invention.

Claims

1. Composition comprising at least one thermoplastic polymer or copolymer and 0.1-5% by weight of metal coated glass flakes.

2. Composition of claim 1 comprising as thermoplastic polymer an aromatic polycarbonate, a rubber graft copolymer or a blend of an aromatic polycarbonate and a rubber graft copolymer.

3. Composition of claim 1 comprising nickel, gold, silver or copper coated glass flakes.

4. Composition of claim 2 comprising nickel, gold, silver or copper coated glass flakes.

5. Use of the composition of claim 1 for the manufacture of the housing of electronic devices which are provided with circuitry suitable for exchange of information at radio frequencies of 500 MHz to 3 GHz.

6. Electronic devices provided with a housing made out of the composition of claim 1.