Methods for manufacturing semiconductor devices and semiconductor devices
First Claim
1. A method for manufacturing a semiconductor device, the method comprising:
- (a) forming a gate dielectric layer over a semiconductor substrate;
(b) forming a gate electrode over the gate dielectric layer;
(c) forming an extension control layer over the semiconductor substrate on sides of the gate dielectric layer; and
(d) forming a first impurity layer and a second impurity layer by ion-implanting an impurity in the semiconductor substrate, wherein an extension region is formed in the semiconductor substrate below the extension control layer during the ion-implanting used to form the first impurity layer and the second impurity layer.
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Abstract
Embodiments include methods for manufacturing semiconductor devices and semiconductor devices in which an extension region, a source region and a drain region can be simultaneously formed. One method for manufacturing a semiconductor device includes (a) forming a gate dielectric layer 20 over a semiconductor substrate 10; (b) forming a gate electrode 22 over the gate dielectric layer 20; (c) forming an extension control layer 40 over the semiconductor substrate 10 on sides of the gate dielectric layer 20; and (d) forming a source region 24 and a drain region 26 by ion-implanting an impurity 80 in the semiconductor substrate 10, wherein an extension region 30 is formed in the semiconductor substrate 10 below the extension control layer 40 with the source region 24 and the drain region 26.
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Citations
24 Claims
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1. A method for manufacturing a semiconductor device, the method comprising:
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(a) forming a gate dielectric layer over a semiconductor substrate;
(b) forming a gate electrode over the gate dielectric layer;
(c) forming an extension control layer over the semiconductor substrate on sides of the gate dielectric layer; and
(d) forming a first impurity layer and a second impurity layer by ion-implanting an impurity in the semiconductor substrate, wherein an extension region is formed in the semiconductor substrate below the extension control layer during the ion-implanting used to form the first impurity layer and the second impurity layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 24)
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10. A semiconductor device comprising:
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a gate dielectric layer provided over a semiconductor substrate;
a gate electrode provided over the gate dielectric layer;
a first impurity layer and a second impurity layer provided in the semiconductor substrate and spaced away from sides of the gate dielectric layer;
an extension region provided in the semiconductor substrate between the gate dielectric layer and at least one of the first impurity layer and the second impurity layer; and
an extension control layer provided over the extension region. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method for manufacturing a semiconductor device including extension regions and source/drain regions formed using a single ion-implantation step, the method comprising:
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forming a gate dielectric layer over a semiconductor substrate;
forming a gate electrode over the gate dielectric layer;
forming extension control structures over a portion of the semiconductor substrate next to the gate dielectric layer; and
a single ion-implanting step that forms extension regions in the semiconductor substrate under the extension control structures and source/drain regions in the semiconductor substrate adjacent to the extension layer, wherein the extension regions have a depth that is less than that of the source/drain regions. - View Dependent Claims (22, 23)
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Specification