Non-contact type IC card and process for manufacturing-same
First Claim
1. A non-contact type IC card comprising:
- an insulating film having first and second surfaces;
a plane coil arranged on said first surface of the film, said plane coil having terminals;
a semiconductor element arranged on said first surface of the film, said semiconductor element having electrode terminals;
said film having through holes which expose said terminals of the plane coil and said electrode terminals of the semiconductor element to said second surface of the film; and
a wiring pattern consisting of conductive paste, filled in said through holes and extending therebetween along said second surface of the film so that said terminals of the plane coil are electrically connected to said electrode terminals of the semiconductor element by means of said wiring pattern.
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Abstract
A non-contact type IC card includes an insulating film having first and second surfaces. A plane coil is arranged on the first surface of the film. A semiconductor element is arranged on the first surface of the film. The film has through holes which expose terminals of the plane coil and electrode terminals of the semiconductor element to the second surface of the film. A wiring pattern consisting of conductive paste is filled in the through holes and extends therebetween along the second surface of the film so that the terminals of the plane coil are electrically connected to the electrode terminals of the semiconductor element by means of the wiring pattern.
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Citations
18 Claims
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1. A non-contact type IC card comprising:
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an insulating film having first and second surfaces;
a plane coil arranged on said first surface of the film, said plane coil having terminals;
a semiconductor element arranged on said first surface of the film, said semiconductor element having electrode terminals;
said film having through holes which expose said terminals of the plane coil and said electrode terminals of the semiconductor element to said second surface of the film; and
a wiring pattern consisting of conductive paste, filled in said through holes and extending therebetween along said second surface of the film so that said terminals of the plane coil are electrically connected to said electrode terminals of the semiconductor element by means of said wiring pattern. - View Dependent Claims (2, 3)
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4. A non-contact type IC card comprising:
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an insulating film having first and second surfaces;
a plane coil arranged on said first surface of the film, said plane coil having terminals;
a semiconductor element arranged on said second surface of the film, said semiconductor element having electrode terminals;
said film having through holes at positions where said electrode terminals of the semiconductor element are exposed by means of said through holes; and
a wiring pattern consisting of conductive paste, filled in said through holes and extending therefrom to said terminals of the plane coil so that said terminals of the plane coil are electrically connected to said electrode terminals of the semiconductor element by means of said wiring pattern. - View Dependent Claims (5, 6, 7)
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8. A process for manufacturing a non-contact type IC card comprising the following steps of:
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forming a plane coil on a first surface of an insulating film;
forming said film with through holes at positions where terminals of the plane coil and electrode terminals of a semiconductor element are to be exposed by said through holes;
mounting said semiconductor element on said first surface of the film so that electrode terminals thereof are positioned at said through holes; and
printing conductive paste so as to be filled in said through holes and extending therebetween along said second surface of the film to form wiring pattern for electrically connecting said terminals of the plane coil to said electrode terminals of the semiconductor element. - View Dependent Claims (9, 10, 11, 12, 14, 15, 16, 17, 18)
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13. A process for manufacturing a non-contact type IC card comprising the following steps of:
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forming a plane coil on a first surface of an insulating film;
forming said film with through holes at positions where electrode terminals of a semiconductor element are to be exposed by said through holes;
mounting said semiconductor element on said second surface of the film so that electrode terminals thereof are positioned at said through holes; and
printing conductive paste so as to be filled in said through holes and extending along said first surface of the film to form a wiring pattern for electrically connecting said terminals of the plane coil to said electrode terminals of the semiconductor element.
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Specification