Laser segmented cutting

• US 20020190435A1
• Filed: 06/06/2002
• Published: 12/19/2002
• Est. Priority Date: 01/31/2001
• Status: Active Grant

• Current Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Original Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Inventors: OʼBrien, James N., Sun, Yunlong, Zou, Lian-Cheng
• Granted Patent: US 6,676,878 B2
• Time in Patent Office: Days
• US Class Current: 264/400
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/032 using optical means
• CPC Class Codes: B23K 26/0622 by shaping pulses
• CPC Class Codes: B23K 26/066 by using masks
• CPC Class Codes: B23K 26/073 Shaping the laser spot
• CPC Class Codes: B23K 26/083 Devices involving movement of the workpiece in at least one axial direction
• CPC Class Codes: B23K 26/0869 Devices involving movement of the laser head in at least one axial direction
• CPC Class Codes: B23K 26/364 for making a groove or trench, e.g. for scribing a break initiation groove
• CPC Class Codes: B23K 26/38 by boring or cutting
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved

Abstract

UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 μm to 1 mm. The laser output (32) is scanned within a first short segment (122) for a predetermined number of passes before being moved to and scanned within a second short segment (122) for a predetermined number of passes. The bite size, segment size (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path 112 where the cut is already completed. Polarization direction of the laser output (32) is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths.

Claims

1. A method of increasing throughput in a laser cutting process, comprising:

directing a first pass of first laser pulses to impinge along a first segment of a cutting path having a cutting path length greater than 100 μ

m, each first laser pulse having a first spot area on a workpiece, the first segment having a first segment length that is longer than the first spot area and shorter than the cutting path length;

directing a second pass of second laser pulses to impinge along a second segment of the cutting path, each second laser pulse having a second spot area on the workpiece, the second segment having a second segment length that is longer than the second spot area and shorter than the cutting path length, the second segment overlapping the first segment by an overlap length greater than at least the first or second spot areas; and

after directing at least the first and second passes of laser pulses, directing a third pass of laser pulses to impinge along a third segment of the cutting path, each third laser pulse having a third spot area on the workpiece, the third segment having a third segment length that is longer than the third spot area and shorter than the cutting path length, the third segment including a subsequent portion of the cutting path other than the first or second segments, wherein the subsequent portion of the cutting path has a nonoverlap length greater than the first, second, or third spot areas.

2. The method of claim 1 in which major portions of the first and second segments overlap.

3. The method of claim 1 in which the second segment includes the first segment.

4. The method of claim 3 in which the first and second segment are processed in a same direction.

5. The method of claim 3 in which the first and second segment are processed in opposite directions.

6. The method of claim 1 in which the first and second segment are processed in a same direction.

7. The method of claim 1 in which the first and second segment are processed in opposite directions.

8. The method of claim 1 in which additional sets of first and/or second laser pulses are applied to the first and/or second segments to form a through trench within the first and/or second segments prior to applying the third laser pulses.

9. The method of claim 1 further comprising:

forming a through trench in the first and/or second segments prior to applying the third laser pulses.

10. The method of claim 1 further comprising:

forming a through trench in the first and/or second segments with multiple passes of laser pulses prior to applying the third laser pulses; and

forming a through trench within the third segment.

11. The method of claim 10 further comprising:

forming a through trench along the entire cutting path length.

12. The method of claim 11 in which the cutting path length is greater than 1 mm and the first, second, and third segment lengths are between about 10 μ

m and about 500 μ

m.

13. The method of claim 1 in which the cutting path length is greater than 1 mm and the first, second, and third segment lengths are between about 10 μ

m and about 500 μ

m.

14. The method of claim 13 in which the cutting path length is greater than 10 mm and the first, second, and third segment lengths are between about 200 μ

m and about 500 μ

m.

15. The method of claim 13 in which the first, second, and third laser pulses are characterized by a UV wavelength, a pulse repetition frequency of greater than 5 kHz, pulse energies of greater than 200 μ

J, and a bite size of about 0.5 to about 50 μ

m.

16. The method of claim 1 in which the first, second, and third laser pulses are characterized by a UV wavelength, a pulse repetition frequency of greater than 5 kHz, pulse energies of greater than 200 μ

J, and a bite size of about 0.5 to about 50 μ

m.

17. The method of claim 16 in which the workpiece has a thickness greater than 50 μ

m.

18. The method of claim 17 in which the workpiece has a thickness greater than 500 μ

m.

19. The method of claim 12 in which the workpiece has a thickness greater than 50 μ

m.

20. The method of claim 12 in which the workpiece has a thickness greater than 500 μ

m, the cutting path length is greater than 100 mm, and the throughout along the entire length of the cutting path is made with fewer than 25 passes of laser pulses over any position along the cutting path.

21. The method of claim 13 in whuich the workpiece has thickness of greater than 200 μ

m, further comprising;

cutting through the entire thickness along the cutting path at a cutting speed of greater than 10 mm per minute.

22. The method of claim 21 in which a major portion of the thickness of the workpiece comprises a semiconductor material, a glass material, a ceramic material, or a metallic material.

23. The method of claim 21 in which a major portion of the thickness of the workpiece comprises Si, GaAs, SiC, SiN, indium phosphide, or AlTiC.

24. The method of claim 22 in which the laser pulses are generated from a solid-state laser or a CO₂ laser.

25. The method of claim 1 in which the laser pulses are generated from a solid-state laser or a CO₂ laser.

26. The method of claim 2 in which the overlap length of the first and second portions or the first or second segment lengths are sufficiently short such that the second laser pulses impinge along the overlap length before a major portion of any debris generated by the first laser pulses cools along the overlap length to ambient temperature.

27. The method of claim 1 in which the third segment excludes the first or second segments.

28. The method of claim 1 in which the first laser pulses impinge along the cutting path in a first cutting direction and the first laser pulses have a first polarization orientation that is parallel to the first cutting direction, in which the third laser pulses impinge along the cutting path in a third cutting direction and the third laser pulses have a third polarization orientation that is parallel to the third cutting direction, and in which the first and third cutting directions are transverse.

29. The method of claim 28 further comprising:

employing a polarization control device to change from the first polarization orientation to the third polarization orientation.

30. The method of claim 10 further comprising:

monitoring throughout status with a throughout monitor to determine throughout positions where throughcuts have been affected along the cutting path; and

reducing impingement of the throughout positions during the passes of first, second, third, or subsequent laser pulses in response to information provided by the throughout monitor.

31. The method of claim 1 in which the laser pulses within the first pass have generally similar parameters.

32. The method of claim 1 in which the laser pulses of the first, second, and third passes have generally similar parameters.

33. The method of claim 1 in which the laser pulses of at least two of the first, second, and third passes have at least one generally different parameter.

34. The method of claim 1 in which at least two of the laser pulses in at least one of the first, second, or third passes have at least one generally different parameter.

35. The method of claim 1 in which multiple passes of laser pulses are applied to the first segment to form a throughout within the first segment.

36. The method of claim 35 in which the throughout is formed in the first segment before the pass of second laser pulses is applied to the second segment.

37. The method of claim 36 in which multiple passes of laser pulses are applied to the second segment to form a throughout within the second segment.

38. The method of claim 37 in which the throughcut is formed in the second segment before the pass of third laser pulses is applied to the third segment.

39. The method of claim 38 in which multiple passes of laser pulses are applied to subsequent segments to sequentially form throughcuts within the respective subsequent segments to form a full length throughout along the cutting path length.

40. The method of claim 1 in which only minor portions of the first and second segments overlap.

41. The method of claim 1 in which the first laser pulses impinge along the cutting path in a first cutting direction and the first laser pulses have a first polarization orientation that is oriented to the first cutting direction to enhance throughput or cut quality, in which the third laser pulses impinge along the cutting path in a third cutting direction and the third laser pulses have a third polarization orientation that is oriented to the third cutting direction to enhance throughput or cut quality, and in which the first and third cutting directions are transverse and the first and third polarization orientations are transverse.

42. The method of claim 1 in which at least one of the segments is an arc.

43. The method of claim 1 in which a purge gas is employed to facilitate blowing potential backfill debris through throughcuts along the cutting path.

44. The method of claim 1 in which an elongated laser pass that includes at least thee first second and third segments is applied to the cutting path.

45. The method of claim 1 in which each spot area along a segment is in proximity to or partly overlaps the spot area of a preceding laser pulse.

48. The method of claim 47 in which impingement of laser pulses along the cutting path generates debris and in which the overlap length or the segment length is sufficiently short such that the second pass of second laser pulses impinge along the overlap length before a major portion of any debris generated by the first laser pulses cools to ambient temperature along the overlap length.

46. A method of increasing throughput in a laser cutting process, comprising:

directing a pass of laser pulses to impinge a workpiece along a cutting path;

monitoring throughcut status with a throughout monitor to determine throughout positions where throughcuts have been affected along the cutting path;

directing a subsequent pass of subsequent laser pulses to impinge the workpiece along the cutting path; and

reducing impingement of the throughcut positions during the subsequent laser pass in response to information provided by the throughout monitor.

47. A method of increasing throughput for forming a cut along a cutting path having a cutting path length on a workpiece, comprising:

selecting a segment length that is shorter than the cutting path length;

directing a first pass of first laser pulses having first spot areas to impinge the workpiece along a first segment of about the segment length along the cutting path;

directing a second pass of second laser pulses having second spot areas to impinge the workpiece along a second segment of about the segment length along the cutting path, the second segment overlapping the first segment by an overlap length greater than at least the first or second spot areas; and

after directing at least the first and second passes of laser pulses, directing a third pass of laser pulses having third spot areas to impinge along a third segment of about the segment length along the cutting path, the third segment including a portion of the cutting path that extends beyond the first or second segments, wherein the portion of the cutting path has a portion length greater than the first, second, or third spot areas.

49. A method of increasing throughput in a laser cutting process, comprising:

directing a first pass of first laser pulses to impinge along a first segment of a cutting path having a cutting path length, each first laser pulse having a first spot area on a workpiece, the first segment having a first segment length that is longer than the first spot area and shorter than the cutting path length;

directing second passes of second laser pulses to impinge along a second segment of the cutting path, the second segment including an overlap length that overlaps at least a portion of the first segment until a throughout is made within the overlap length, each second pulse having a second spot area on a workpiece, the second segment having a second segment length that is longer than the second spot area and shorter than the cutting path length, the overlap length being greater than at least the first or second spot areas; and

after directing at least the first and second passes of laser pulses, directing third passes of laser pulses to impinge along a third segment of the cutting path until a throughout is made within the third segment, each third laser pulse having a third spot area on a workpiece, the third segment having a third segment length that is longer than the third spot area and shorter than the cutting path length, the third segment including a portion of the cutting path that extends beyond the first or second segments, wherein the portion of the cutting path has a portion length greater than the first, second, or third spot areas.

50. A laser system for cutting a semiconductor material, comprising:

a laser for generating laser pulses; and

a beam positioning system for sequentially directing first and second passes of respective first and second laser pulses to impinge along respective first and second segments of a cutting path having a cutting path length until a throughout is made within the first segment before directing a third pass of third laser pulses at a third segment that extends beyond the first and second segments along the cutting path, each laser pulse having a spot area on a workpiece, the segments having segment lengths that are longer than the spot area and shorter than the cutting path length;

the second segment including an overlap length that overlaps at least a portion of the first segment.

51. The laser system of claim 50 further comprising a throughout monitor that determines throughout positions where throughcuts have been affected along the cutting path and that directly or indirectly supplies data concerning the throughout positions to the beam positioning system to reduce impingement of the throughout positions during first, second, third, or subsequent laser passes in response to the data provided by the throughout monitor.

52. The laser system of claim 50 further comprising a beam polarization controller such that the first laser pulse impinge along the cutting path in a first cutting direction and the first laser pulses are imparted a first polarization orientation that is oriented to the first cutting direction to enhance throughput or cut quality, such that the third laser pulses impinge along the cutting path in a third cutting direction and the third laser pulses are imparted a third polarization orientation that is oriented to the third cutting direction to enhance throughput or cut quality, and such that the first and third cutting directions are transverse and the first and third polarization orientations are transverse.