Light emission apparatus and method of fabricating the same

• US 20020190637A1
• Filed: 03/28/2002
• Published: 12/19/2002
• Est. Priority Date: 03/30/2001
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd., Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Inventors: Matsubara, Hideki, Ishinaga, Hiroki, Takebe, Toshihiko, Maegawa, Mamoru
• Granted Patent: US 6,741,029 B2
• Time in Patent Office: Days
• US Class Current: 313/503
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: Y10T 428/24983 Hardness

Abstract

A light emission apparatus includes: an electrode; a LED mounted on the electrode with an indium layer posed therebetween, the LED having a substrate formed of an n-type ZnSe single crystal, and an epitaxial light emission structure formed of a compound crystal relating ZnSe serving as a matrix, the epitaxial light emission structure being provided on the substrate and emitting light when an electric current is introduced thereinto; and resin encapsulating the LED, the resin having a glass transition temperature of lower than 80 degrees centigrade or being soft to be still elastic in a vicinity of the LED at room temperature.

Claims

1. A light emission apparatus comprising:

an electrode;

a light emitting device mounted on said electrode with an indium layer posed therebetween, said light emitting device having a substrate formed of an n-type ZnSe single crystal, and an epitaxial light emission structure formed of a compound crystal relating ZnSe serving as a matrix thereof, said epitaxial light emission structure being provided on said substrate and emitting light when an electric current is introduced thereinto; and

resin encapsulating said light emitting device, said resin having a glass transition temperature of lower than 80 degrees centigrade.

2. The apparatus of claim 1, wherein said resin includes epoxy resin having a glass transition temperature of higher than 30 degrees centigrade and lower than 80 degrees centigrade and being transparent or having a light diffusing agent mixed therein.

3. The apparatus of claim 1, further comprising a base formed of insulator, wherein said electrode includes a patterned electrode formed on said base.

4. The apparatus of claim 3, further comprising a reflector provided on said base to surround said light emitting device for reflecting fluorescence received from said substrate, wherein said resin is introduced into a region surrounded by said reflector.

5. A light emission apparatus comprising:

an electrode;

a light emitting device mounted on said electrode with an indium layer posed therebetween, said light emitting device having a substrate formed of an n-type ZnSe single crystal, and an epitaxial light emission structure formed of a compound crystal relating ZnSe serving as a matrix thereof, said epitaxial light emission structure being provided on said substrate and emitting light when an electric current is introduced thereinto; and

resin encapsulating said light emitting device, said resin including a first resin transparent or having a light diffusing agent mixed therein, and covering said light emitting device, and a second resin transparent or having a light diffusing agent mixed therein, and covering said first resin, said first resin having an elasticity corresponding to an elongation of no less than 40% at room temperature, said second resin being grater in hardness than said first resin.

6. The apparatus of claim 5, wherein said first resin includes silicone resin and said second resin includes epoxy resin.

7. The apparatus of claim 5, further comprising a base formed of insulator, wherein said electrode includes a patterned electrode formed on said base.

8. The apparatus of claim 7, further comprising a reflector provided on said base to surround said light emitting device for reflecting fluorescence received from said substrate, wherein said resin is introduced into a region surrounded by said reflector.

9. A method of fabricating a light emission apparatus, comprising the steps of:

mounting a light emitting device on an electrode with an indium layer posed therebetween, said light emitting device having a substrate formed of an n-type ZnSe single crystal, and an epitaxial light emission structure formed of a compound crystal relating ZnSe serving as a matrix thereof, said epitaxial light emission structure being provided on said substrate and emitting light when an electric current is introduced thereinto; and

dropping epoxy resin on said light emitting device and then curing said epoxy resin to encapsulate said light emitting device with said epoxy resin, said epoxy resin having a glass transition temperature of lower than 80 degrees centigrade.

10. A method of fabricating a light emission apparatus, comprising the steps of:

mounting a light emitting device on an electrode with an indium layer posed therebetween, said light emitting device having a substrate formed of an n-type ZnSe single crystal, and an epitaxial light emission structure formed of a compound crystal relating ZnSe serving as a matrix thereof, said epitaxial light emission structure being provided on said substrate and emitting light when an electric current is introduced thereinto;

covering said light emitting device with silicone resin; and

transfer-molding epoxy resin to cover said silicone resin therewith.