Integrating tool, module, and fab level control

• US 20020193902A1
• Filed: 06/18/2002
• Published: 12/19/2002
• Est. Priority Date: 06/19/2001
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Schwarm, Alexander T., Shanmugasundram, Arulkumar P.
• Granted Patent: US 7,047,099 B2
• Time in Patent Office: Days
• US Class Current: 700/121
• CPC Class Codes: B24B 49/18 taking regard of the presence of dressing tools
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools
• CPC Class Codes: G05B 19/41865 characterised by job scheduling, process planning, material flow
• CPC Class Codes: G05B 2219/32053 Adjust work parameter as function of other cell
• CPC Class Codes: G05B 2219/32065 Synchronise set points of processes
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/67276 Production flow monitoring, e.g. for increasing throughput program-control systems per se G05B19/00, e.g. total factory control G05B19/418
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

Semiconductor wafers are processed in a fab in a manner that integrates control at multiple functional unit levels. Examples of functional units include fabs, modules, tools, and the like. Initially, a number of functional unit property targets are received at a functional unit. The functional unit property targets are utilized to generate a number of tool targets for any number of tool level functional units. From there, the tool targets are forwarded to the corresponding tool level functional units. At these tool level functional units, a number of tool recipes, each of which define a number of process setpoints, may be generated by processing the tool targets. The process setpoints define a number of parameters which must be satisfied in order to attain the corresponding tool targets. In addition, in at least some embodiments, the tool targets and tool recipes are determined utilizing feedback information including functional unit states and measurements of controlled parameters.

Claims

1. A method for processing wafers in a fab, said method comprising the steps of:

(1) receiving, at a first functional unit, one or more functional unit property targets associated with said first functional unit;

(2) generating one or more tool targets for one or more tool level functional units, by processing said one or more functional unit property targets associated with said first functional unit;

(3) forwarding said one or more tool targets to said one or more tool level functional units; and

(4) generating one or more tool recipes defining one or more process setpoints, by processing said one or more tool targets at said one or more tool level functional units.

2. The method of claim 1, wherein said first functional unit comprises a fab.

3. The method of claim 1, wherein said first functional unit comprises a module.

4. The method of claim 1, wherein said one or more tool recipes are generated according to tool measurements of controlled parameters.

5. The method of claim 1, wherein said one or more tool targets are generated according to state information from at least one tool level functional unit other than said one or more tool level functional units.

6. The method of claim 1, wherein said one or more tool recipes are generated according to measurements of controlled parameters measured from a second functional unit or said tool level functional units.

7. The method of claim 1, wherein said one or more tool recipes are generated according to state information from a second functional unit or said tool level functional units.

8. The method of claim 1, further comprising utilizing a tool recipe of said one or more tool recipes corresponding to a first tool level functional unit in obtaining a tool final product associated with a second tool level functional unit.

9. The method of claim 1, further comprising:

receiving, at a second functional unit, one or more functional unit property targets associated with said second functional unit;

generating said one or more functional unit property targets for at least said first functional unit, by processing said one or more functional unit property targets associated with said second functional unit; and

forwarding said one or more functional unit property targets associated with said second functional unit to said first functional unit.

10. The method of claim 1, wherein at least one tool level functional unit of said one or more tool level functional units includes an integrated metrology device or sensor for measuring controlled parameters.

11. The method of claim 1, wherein said one or more tool recipes are generated on a wafer to wafer basis.

12. The method of claim 1, wherein one or more models are used to generate said one or more tool targets.

13. The method of claim 1, wherein one or more models are used to generate said one or more tool recipes.

14. The method of claim 1, wherein one or more models are used to generate said one or more tool targets and wherein said one or more models are constructed utilizing design of experiment techniques.

15. The method of claim 1, wherein one or more models are used to generate said one or more tool targets and wherein said one or more models are constructed utilizing design constraints based on physical and/or empirical knowledge of said first functional unit or said tool level functional units.

16. The method of claim 1, wherein said processing of said one or more functional unit property targets associated with said first functional unit comprises generating one or more functional unit property targets associated with a second functional unit, and wherein said one or more tool targets are generated by processing said one or more functional unit property targets associated with said second functional unit.

17. The method of claim 1, further comprising the step of:

(5) executing said one or more tool recipes on said one or more tool level functional units

19. The method of claim 18, wherein said one or more functional unit targets is generated utilizing at least one of measurements of controlled parameters and state information.

20. The method of claim 18, wherein said one or more functional unit targets is generated utilizing information measured from an in situ sensor.

18. A method for processing wafers in a functional unit of a fab, said method comprising the steps of:

(1) constructing one or more models utilizing at least one of design of experiment techniques and design constraints based on physical and/or empirical knowledge of said functional unit; and

(2) generating one or more functional unit targets associated with said functional unit utilizing said one or more models.

21. A system for processing wafers, said system comprising:

a first functional unit comprising a controller capable of receiving one or more functional unit property targets associated with said functional unit and generating one or more tool targets by processing said one or more functional unit property targets associated with said first functional unit; and

one or more tool level functional units capable of receiving said one or more tool targets from said first functional unit and generating one or more tool recipes defining one or more process setpoints, by processing said one or more tool targets, wherein said one or more tool targets may be accomplished by attaining said one or more process setpoints.

22. The system of claim 21, further comprising an integrated metrology device or sensor for measuring controlled parameters.

23. The system of claim 21, further comprising:

a second functional unit comprising a controller capable of receiving one or more functional unit property targets associated with said second functional unit, generating said one or more functional unit property targets for at least said first functional unit, by processing said one or more functional unit property targets associated with said second functional unit, and forwarding said one or more functional unit property targets associated with said second functional unit to said first functional unit.

24. The system of claim 21, wherein said one or more tool targets are generated according to state information from at least one tool level functional unit other than said one or more tool level functional units.

25. The system of claim 21, wherein said one or more tool recipes are generated according to measurements of controlled parameters measured from a second functional unit or said tool level functional units.

26. The system of claim 21, wherein said one or more tool recipes are generated according to state information from a second functional unit or said tool level functional units.

27. The system of claim 21, wherein a tool recipe of said one or more tool recipes corresponding to a first tool level functional unit in obtaining a tool final product associated with a second tool level functional unit.

28. The system of claim 21, wherein said one or more tool recipes are generated according to tool measurements of controlled parameters.

29. The system of claim 21, wherein one or more models are used to generate said one or more tool targets and wherein said one or more models are constructed utilizing design constraints based on physical and/or empirical knowledge of said first functional unit or said tool level functional units.

30. The system of claim 21, further comprising a first functional unit controller for generating one or more functional unit property targets associated with a second functional unit, and wherein said one or more tool targets are generated by processing said one or more functional unit property targets associated with said second functional unit.

31. The system of claim 21, wherein said first functional unit comprises a fab.

32. The system of claim 21, wherein said first functional unit comprises a module.

33. A system for processing wafers, said system comprising:

a first functional unit comprising a controller for constructing one or more models utilizing at least one of design of experiment techniques and design constraints based on physical and/or empirical knowledge of said functional unit, and wherein said controller generates one or more functional unit targets associated with said functional unit utilizing said one or more models.

34. The system of claim 33, wherein said one or more functional unit targets is generated utilizing at least one of measurements of controlled parameters and state information.

35. The system of claim 33, further comprising an in situ sensor or other integrated metrology device for measuring information used in generating said one or more functional unit targets.

37. The system of claim 36, further comprising means for measuring controlled parameters.

38. The system of claim 36, wherein said one or more tool targets are generated according to state information from at least one tool level functional unit other than said one or more tool level functional units.

39. The system of claim 36, wherein said one or more tool recipes are generated according to measurements of controlled parameters measured from a second functional unit or said tool level functional units.

40. The system of claim 36, wherein said one or more tool recipes are generated according to state information from a second functional unit or said tool level functional units.

41. The system of claim 36, further comprising means for utilizing a tool recipe of said one or more tool recipes corresponding to a first tool level functional unit in obtaining a tool final product associated with a second tool level functional unit.

42. The system of claim 36, further comprising:

means for receiving, at a second functional unit, one or more functional unit property targets associated with said second functional unit;

means for generating said one or more functional unit property targets for at least said first functional unit, by processing said one or more functional unit property targets associated with said second functional unit; and

means for forwarding said one or more functional unit property targets associated with said second functional unit to said first functional unit.

43. The system of claim 36, wherein one or more models are used to generate said one or more tool targets and wherein said one or more models are constructed utilizing design constraints based on physical and/or empirical knowledge of said first functional unit or said tool level functional units.

36. A system for processing wafers, said system comprising:

means for receiving, at a first functional unit, one or more functional unit property targets associated with said first functional unit;

A means for generating one or more tool targets for one or more tool level functional units, by processing said one or more functional unit property targets associated with said first functional unit;

means for forwarding said one or more tool targets to said one or more tool level functional units; and

means for generating one or more tool recipes defining one or more process setpoints, by processing said one or more tool targets at said one or more tool level functional units.

44. A system for processing wafers in a functional unit of a fab, said system comprising:

means for constructing one or more models utilizing at least one of design of experiment techniques and design constraints based on physical and/or empirical knowledge of said functional unit; and

means for generating one or more functional unit targets associated with said functional unit utilizing said one or more models.

45. The system of claim 44, wherein said one or more functional unit targets is generated utilizing at least one of measurements of controlled parameters and state information.

46. The system of claim 44, further comprising means for measuring information used in generating said one or more functional unit targets.

48. The computer readable medium of claim 47, further comprising computer readable instructions for executing said one or more tool recipes on said one or more tool level functional units

49. The computer readable medium of claim 47, wherein said one or more tool recipes are generated according to measurements of controlled parameters measured from a second functional unit or said tool level functional units.

50. The computer readable medium of claim 47, wherein said one or more tool recipes are generated according to state information from a second functional unit or said tool level functional units.

51. The computer readable medium of claim 47, further comprising computer readable instructions for utilizing a tool recipe of said one or more tool recipes corresponding to a first tool level functional unit in obtaining a tool final product associated with a second tool level functional unit.

52. The computer readable medium of claim 47, further comprising:

computer readable instructions for receiving, at a second functional unit, one or more functional unit property targets associated with said second functional unit;

computer readable instructions for generating said one or more functional unit property targets for at least said first functional unit, by processing said one or more functional unit property targets associated with said second functional unit; and

computer readable instructions for forwarding said one or more functional unit property targets associated with said second functional unit to said first functional unit.

53. The computer readable medium of claim 47, further comprising computer readable instructions for measuring controlled parameters.

54. The computer readable medium of claim 47, wherein said one or more tool targets are generated according to state information from at least one tool level functional unit other than said one or more tool level functional units.

47. A computer readable medium for use in processing wafers in a fab, said computer readable medium comprising:

computer readable instructions for receiving, at a first functional unit, one or more functional unit property targets associated with said first functional unit;

computer readable instructions for generating one or more tool targets for one or more tool level functional units, by processing said one or more functional unit property targets associated with said first functional unit;

computer readable instructions for forwarding said one or more tool targets to said one or more tool level functional units; and

computer readable instructions for generating one or more tool recipes defining one or more process setpoints, by processing said one or more tool targets at said one or more tool level functional units.

55. A computer readable medium for use in processing wafers in a functional unit of a fab, said computer readable medium comprising:

computer readable instructions for constructing one or more models utilizing at least one of design of experiment techniques and design constraints based on physical and/or empirical knowledge of said functional unit; and

computer readable instructions for generating one or more functional unit targets associated with said functional unit utilizing said one or more models.

56. The computer readable medium of claim 55, wherein said one or more functional unit targets is generated utilizing at least one of measurements of controlled parameters and state information.

57. The computer readable medium of claim 55, wherein said one or more functional unit targets is generated utilizing information measured from an in situ sensor.

59. The method of claim 58, wherein said one or more design constraints relates said one or more functional unit property targets associated with said first functional unit with said one or more tool targets based on relationships between at least one of inputs, functional unit physics, and/or empirical models.

60. The method of claim 58, wherein said one or more design constraints are determined according to functional unit processing capabilities.

58. A method for generating tool targets for use in processing wafers, said method comprising the steps of:

(1) receiving, at a first functional unit, one or more functional unit property targets associated with said first functional unit;

(2) identifying one or more design constraints according to said one or more functional unit property targets associated with said first functional unit; and

(3) generating one or more tool targets for one or more tool level functional units, by processing said one or more design constraints, wherein said one or more design constraints dictate limits of said one or more tool targets, as determined at least in part by results of one or more upstream and/or downstream targets.

61. A system for generating tool targets for use in processing wafers, said system comprising:

a first functional unit comprising a controller for receiving one or more functional unit property targets associated with said first functional unit; and

a processor capable of identifying one or more design constraints according to said one or more functional unit property targets associated with said first functional unit and generating one or more tool targets for one or more tool level functional units, by processing said one or more a design constraints, wherein said one or more design constraints dictate limits of said one or more tool targets, as determined at least in part by results of upstream and/or downstream targets.

62. The system of claim 61, wherein said one or more design constraints relates said one or more functional unit property targets associated with said first functional unit with said one or more tool targets based on relationships between at least one of inputs, functional unit physics, and/or empirical models.

63. The system of claim 61, wherein said one or more design constraints are determined according to functional unit processing capabilities.

64. A system for generating tool targets for use in processing wafers, said system comprising:

means for receiving, at a first functional unit, one or more functional unit property targets associated with said first functional unit;

means for identifying one or more design constraints according to said one or more functional unit property targets associated with said first functional unit; and

means for generating one or more tool targets for one or more tool level functional units, by processing said one or more design constraints, wherein said one or more design constraints dictate limits of said one or more tool targets, as determined at least in part by results of upstream and/or downstream targets.

65. The system of claim 64, wherein said one or more design constraints relates said one or more functional unit property targets associated with said first functional unit with said one or more tool targets based on relationships between at least one of inputs, functional unit physics, and/or empirical models.

66. The system of claim 64, wherein said one or more design constraints are determined if according to functional unit processing capabilities.

68. The computer readable medium of claim 67, wherein said one or more design constraints relates said one or more functional unit property targets associated with said first functional unit with said one or more tool targets based on relationships between at least one of inputs, functional unit physics, and/or empirical models.

69. The computer readable medium of claim 67, wherein said one or more design constraints are determined according to functional unit processing capabilities.

67. A computer readable medium for generating tool targets for use in processing wafers, said computer readable medium comprising:

computer readable instructions for receiving, at a first functional unit, one or more functional unit property targets associated with said first functional unit;

computer readable instructions for identifying one or more design constraints according to said one or more functional unit property targets associated with said first functional unit; and

computer readable instructions for generating one or more tool targets for one or more tool level functional units, by processing said one or more design constraints, wherein said one or more design constraints dictate limits of said one or more tool targets, as determined at least in part by results of upstream and/or downstream targets.