Conductive shape memory metal deployment latch hinge deployment method
First Claim
1. A method of forming a hinge for moving panels from a stowed position to a deploy position for forming a hinged surface of panels, the method comprising the steps of, heating a shape memory alloy to above a crystal transition temperature, deforming the shape memory alloy as the hinge when above the training temperature to train the shape memory alloy to the deployed position, the hinge being trained to return to the deployed position when release from the stowed position, and cooling the shape memory alloy to below the crystal transition temperature.
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Abstract
A conductive hinge is made of a superelastic shape memory alloy such as nitinol (NiTi) having a large elastic strain limit for enabling the hinge to bend to a small radius during stowage for flexible return to a trained rigid hinge position by training the shape memory alloy to assume a predetermined deployed configuration when released from a stowage configuration. The hinge is trained by forging at a temperature above a training temperature. The hinge is released to deploy solar cell panels as the hinges unfold to the forged trained deployed configuration.
101 Citations
16 Claims
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1. A method of forming a hinge for moving panels from a stowed position to a deploy position for forming a hinged surface of panels, the method comprising the steps of,
heating a shape memory alloy to above a crystal transition temperature, deforming the shape memory alloy as the hinge when above the training temperature to train the shape memory alloy to the deployed position, the hinge being trained to return to the deployed position when release from the stowed position, and cooling the shape memory alloy to below the crystal transition temperature.
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9. A method of forming a hinged surface of panels, the method comprising the steps of,
forming hinges from a shape memory alloy, each of the hinges having a proximal end for securing to a first panel of the panels and a distal end for securing to a second panel of the panels, heating each of the hinges to above a training temperature of the shape memory alloy, deforming the hinges when above the training temperature to train the hinges to a deployed position, the hinges being trained to return to the deployed position when released from a stowed position, and cooling the hinges to below the training temperature, and securing the hinges to the panels, the panels forming the hinged surface when interconnected together by the hinges when in the deployed position.
Specification