Method for thermally releasing adherend and apparatus for thermally releasing adherend

• US 20020195199A1
• Filed: 04/25/2002
• Published: 12/26/2002
• Est. Priority Date: 04/25/2001
• Status: Abandoned Application

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Izutani, Seiji, Arimitsu, Yukio, Kawanishi, Michirou
• Application Number:
  US10/131,178
• Publication Number:
  US 20020195199A1
• Time in Patent Office: Days
• US Class Current: 156/710
• CPC Class Codes: C09J 2301/208 the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
• CPC Class Codes: C09J 2301/412 presence of microspheres
• CPC Class Codes: C09J 7/38 Pressure-sensitive adhesives [PSA]
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 2221/68322 Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: Y10T 156/1147 Using shrinking or swelling agent during delaminating
• CPC Class Codes: Y10T 156/1153 Temperature change for delamination [e.g., heating during delaminating, etc.]
• CPC Class Codes: Y10T 156/1184 Piercing layer during delaminating [e.g., cutting, etc.]
• CPC Class Codes: Y10T 156/1911 Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
• CPC Class Codes: Y10T 156/1967 Cutting delaminating means

Abstract

The invention provides a method for thermally releasing an adherend, which comprises selectively releasing one or some of a plurality of substances adhered on a thermally releasable pressure-sensitive adhesive sheet having a thermally expandable layer containing therein thermo-expandable microspheres, by partly heating the pressure-sensitive adhesive sheet using a heating unit capable of partly heating the pressure-sensitive adhesive sheet. This thermally releasing method may further involve a step of cutting the substance adhered to the pressure-sensitive adhesive sheet. In this occasion, the heating unit has a heating portion of a shape in conformity with the shape of the adherend to be released, and may be provided on at lease one of the side to which the adherend is adhered and the opposite side thereto of the pressure-sensitive adhesive sheet.

Claims

1. A method for thermally releasing an adherend, which comprises selectively releasing a plurality of adherends adhered on a thermally releasable pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet comprising a thermally expandable layer containing thermo-expandable microspheres, by partly heating the pressure-sensitive adhesive sheet.

2. The method as described in claim 1, wherein the selective release is conducted by heating an adhered portion of the at least one adherend to be released, with a heating unit having a heating portion, in which the heating portion has a shape corresponding to that of the at least one adherend to be released.

3. The method as described in claim 1, wherein at least one of the adherend-adhered side and the opposite side thereto of the pressure-sensitive adhesive sheet is subjected to the heating.

4. The method as described in claim 1, wherein the pressure-sensitive adhesive sheet further comprises a rubbery organic elastic layer.

5. A method for thermally releasing an adherend, which comprises the steps of:

cutting an adherend adhered to a thermally releasable pressure-sensitive adhesive sheet, into a plurality of cut pieces, the pressure sensitive adhesive sheet comprising a thermally expandable layer containing thermo-expandable microspheres; and

selectively releasing the cut pieces by partly heating the plurality of cut pieces with a heating unit for partly heating the pressure-sensitive adhesive sheet.

6. The method as described in claim 5, wherein the pressure-sensitive adhesive sheet further comprises a rubbery organic elastic layer.

7. An apparatus for thermally releasing part of a plurality of adherends from a thermally releasable pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet comprising a thermally expandable layer containing thermo-expandable microspheres, which comprises:

a fixing unit for fixing the pressure-sensitive adhesive sheet; and

a heating unit for partly heating the pressure-sensitive adhesive sheet to selectively release the plurality of the adherends from the pressure-sensitive adhesive sheet.

8. The apparatus as described in claim 7, wherein the heating unit includes a heating portion having a shape in conformity with the shape of each of the adherends to be released.

9. The apparatus as described in claim 7, wherein the heating unit including the heating portion is provided at least on one of an adherends-adhered side and an opposite side thereto of the pressure-sensitive adhesive sheet.

10. The apparatus as described in claim 7, wherein the fixing unit for fixing the pressure-sensitive adhesive sheet is movable in at least one of horizontal and vertical directions of the pressure-adhesive sheet.

11. The apparatus as described in claim 7, wherein the heating unit for partly heating the pressure-sensitive adhesive sheet is movable in at least one of horizontal and vertical directions of the pressure-adhesive sheet.

12. An apparatus for thermally releasing cut pieces of an adherend, which comprises:

a fixing unit for fixing a thermally releasable pressure-sensitive adhesive sheet comprising a thermally expandable layer containing thermo-expandable microspheres;

a cutting unit for cutting an adherend adhered on the pressure-sensitive adhesive sheet so as to form a plurality of cut pieces; and

a heating unit for partly heating the pressure-sensitive adhesive sheet to selectively release the plurality of the cut pieces from the pressure-sensitive adhesive sheet.