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Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements

  • US 20020195352A1
  • Filed: 04/04/2002
  • Published: 12/26/2002
  • Est. Priority Date: 03/27/2000
  • Status: Active Grant
First Claim
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1. An apparatus for electrochemically treating a surface of a substrate, comprising:

  • a substrate holder;

    a plurality of dynamically operable concentric anodes opposite said substrate holder;

    a diffuser shield located between said substrate holder and said concentric anodes; and

    an insert shield located between said diffuser shield and said substrate holder.

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