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Substrate for semiconductor device, manufacturing method thereof, semiconductor device, and frame main body

  • US 20020195695A1
  • Filed: 05/23/2002
  • Published: 12/26/2002
  • Est. Priority Date: 05/30/2001
  • Status: Active Grant
First Claim
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1. A substrate for semiconductor device comprising:

  • insulating substrate body having a cut-away portion cut away from a side surface thereof;

    die pad for securing semiconductor chip, said die pad being positioned on said insulating substrate body;

    a plurality of bonding electrodes surrounding said die pad;

    a plurality of external electrodes for allowing said substrate for semiconductor device to be mounted, each external electrode being electrically connected to said bonding electrode and being positioned under said insulating substrate body;

    wiring for surface treatment extending on said insulating substrate body with an end thereof being located at a portion of a side surface of said insulating substrate body, said portion being opposed said cut-away portion, wherein said bonding electrode and said wiring for surface treatment as well as said external electrode and said wiring for surface treatment are electrically connected, respectively.

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