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Method of polishing a substrate

  • US 20020197935A1
  • Filed: 02/14/2000
  • Published: 12/26/2002
  • Est. Priority Date: 02/14/2000
  • Status: Abandoned Application
First Claim
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1. A method of polishing a substrate, which method comprises (a) providing a polishing slurry comprising a liquid carrier and silica particles, wherein the average size of the silica particles is less than 30 nm, (b) providing a polymeric polishing pad substantially free of bound abrasive particles and having a polishing surface comprising a multiplicity of cavities, and (c) polishing the surface of the substrate by contacting the polishing slurry and the polishing pad with the substrate and moving the polishing pad relative to the substrate.

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