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Flexible tape electronics packaging

  • US 20030001287A1
  • Filed: 06/27/2001
  • Published: 01/02/2003
  • Est. Priority Date: 06/27/2001
  • Status: Active Grant
First Claim
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1. A method comprising:

  • forming a thin, flexible substrate having a conductor region adapted to mount an integrated circuit;

    forming a plurality of traces in the conductor region; and

    forming a plurality of lands coupled to the traces.

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