LED lamp package for packaging an LED driver with an LED

• US 20030001657A1
• Filed: 09/03/2002
• Published: 01/02/2003
• Est. Priority Date: 05/18/2001
• Status: Active Grant

• Current Assignee: Eugene Robert Sr. Worley, Eugene R. Worley Jr
• Original Assignee: Eugene Robert Sr. Worley, Eugene R. Worley Jr
• Inventors: Worley, Eugene R. Jr., Worley, Eugene Robert Sr.
• Granted Patent: US 6,646,491 B2
• Time in Patent Office: Days
• US Class Current: 327/514
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/32257 the layer connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H03K 17/063 in field-effect transistor switches
• CPC Class Codes: H05B 45/00 Circuit arrangements for operating light-emitting diodes [LED]

Abstract

An LED lamp package for packaging an LED driver with an LED is provided. In one embodiment, the LED lamp package includes an LED driver chip and an LED chip, both of which are mounted on the ground lead of the LED lamp package and both of which are enclosed by the light transparent encapsulant of the LED lamp package. In another embodiment, the LED chip is mounted on top of the LED driver chip in the LED lamp package. In this embodiment, the LED driver chip includes an attachment pad, on which the bottom surface of the LED chip is mounted.

Claims

1. An LED lamp package, comprising:

a first lead;

a second lead;

an LED chip mounted on the first lead, the LED chip comprising an LED;

an LED driver chip mounted on the first lead and electrically coupled to the second lead, the LED driver chip comprising an LED driver for driving the LED of the LED chip; and

an encapsulant enclosing the LED chip, the LED driver chip, a portion of the first lead, and a portion of the second lead.

2. The LED lamp package of claim 1, wherein the encapsulant has a hemispherical dome.

3. The LED lamp package of claim 1, wherein the first lead has a reflector dish and the LED chip is mounted on the reflector dish.

4. The LED lamp package of claim 3, wherein the LED driver chip is mounted on the reflector dish.

5. The LED lamp package of claim 1, wherein the LED chip and the LED driver chip are mounted on the first lead by electrically conductive epoxy.

6. The LED lamp package of claim 1, further comprising a third lead electrically coupled to the LED driver chip.

7. The LED lamp package of claim 1, wherein the LED driver chip is electrically coupled to the second lead by a bond wire.

8. An LED lamp package, comprising:

a first lead;

a second lead;

an LED chip comprising an LED;

an LED driver chip mounted on the first lead and electrically coupled to the second lead, the LED driver chip comprising an LED driver for driving the LED of the LED chip, wherein the LED chip is mounted on the LED driver chip; and

an encapsulant enclosing the LED chip, the LED driver chip, a portion of the first lead, and a portion of the second lead.

9. The LED lamp package of claim 8, wherein the LED chip is mounted on the LED driver chip by electrically conductive epoxy.

10. The LED lamp package of claim 8, wherein the LED diver chip comprises a pad and the LED chip is mounted on the pad.

11. The LED lamp package of claim 10, wherein the LED chip is mounted on the pad by electrically conductive epoxy.

12. The LED lamp package of claim 8, wherein the encapsulant has a hemispherical dome.

13. The LED lamp package of claim 8, wherein the first lead has a reflector dish and the LED driver chip is mounted on the reflector dish.

14. The LED lamp package of claim 8, further comprising a third lead electrically coupled to the LED driver chip.

15. The LED lamp package of claim 8, wherein the LED driver chip is electrically coupled to the second lead by a bond wire.