Method for checking a conductive connection between contact points
First Claim
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1. A method for checking a conductive connection between contact points of semiconductor chips formed on a wafer and mating contacts of a test head, the method which comprises:
- connecting functionally identical contact points of the semiconductor chips in columns using column lines configured in the test head;
outputting test signals, which are temporally offset, in rows from the semiconductor chips to the column lines; and
detecting and evaluating the test signals, which are temporally offset, from the column lines.
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Abstract
In order to test, in parallel, semiconductor chips formed on a wafer, functionally identical contact points of the semiconductor chips are connected to column lines, and the rows of the semiconductor chips are selected by selection signal lines. This method is suitable in particular for checking electrically conductive connections between contact points of the semiconductor chips and mating contacts of a test head.
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Citations
8 Claims
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1. A method for checking a conductive connection between contact points of semiconductor chips formed on a wafer and mating contacts of a test head, the method which comprises:
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connecting functionally identical contact points of the semiconductor chips in columns using column lines configured in the test head;
outputting test signals, which are temporally offset, in rows from the semiconductor chips to the column lines; and
detecting and evaluating the test signals, which are temporally offset, from the column lines. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification