Vertically integrated optical devices coupled to optical fibers

• US 20030002809A1
• Filed: 05/15/2002
• Published: 01/02/2003
• Est. Priority Date: 06/08/1998
• Status: Active Grant

• Current Assignee: Arrayed Fiberoptics Corp.
• Original Assignee: Arrayed Fiberoptics Corp.
• Inventors: Jian, Benjamin B.
• Granted Patent: US 6,981,804 B2
• Time in Patent Office: Days
• US Class Current: 385/73
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: G02B 6/4206 Optical features G02B6/4207, G02B6/421 take precedence
• CPC Class Codes: G02B 6/4224 using visual alignment markings, e.g. index methods
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G02B 6/4239 Adhesive bonding; Encapsulation with polymer material

Abstract

Integrated optical devices in which one or more optical fibers are vertically integrated with other optical components in a multilayer arrangement. Optical components include lenses, etalons that may be passive or actuable, WDM filters and beamsplitters, for example. One vertically integrated optical device comprises a fiber socket layer comprising a plurality of sockets including a first socket and second socket arranged proximate to each other, and a lens that has a central axis offset from the cores of the first and second fibers. Optical devices include filters, variable optical attenuators, and switches, for example. A component layer may comprise a spacer layer that provides a predetermined opening that is hermetically sealed to protect sensitive components, such as MEMS devices. Also, a method of forming a socket layer using a two-sided etching process is disclosed. Furthermore, an integrated laser device is disclosed that includes a laser layer.

Claims

24. A method of forming a socket layer for holding a plurality of optical fibers, comprising:

forming a first mask on a first surface of a wafer, said first mask defining a pattern including a first plurality of socket openings;

forming a second mask on a second, opposing surface of said wafer, said second mask including a second plurality of socket openings aligned with said first plurality of socket holes;

etching said first surface;

etching said second surface to etch through a socket between said socket openings in said first and second masks; and

removing said first and second masks.

28. An integrated waveguide device comprising:

a fiber socket layer including a fiber socket;

an optical fiber situated in said fiber socket;

an in-plane waveguide including beam turning elements arranged to convert the beam from an in-plane emission to a surface normal orientation that is arranged to couple into the optical fiber.

33-1. An integrated laser device comprising:

a fiber socket layer including a fiber socket;

an optical fiber situated in said fiber socket;

a first component layer connected to the socket layer, said first component layer comprising a microlens;

a laser layer that comprises a semiconductor material connected to said first component layer, including

a laser facet formed on a surface of the laser layer,

a turning mirror formed on said surface;

an in-plane laser area defined between said laser facet and turning mirror; and

a partial reflector situated in said device, said partial reflector and said laser facet defining a laser cavity.34. The laser device of claim 33 wherein said partial reflector is situated proximate to the end of said optical fiber.