Microrelay

• US 20030006868A1
• Filed: 08/02/2002
• Published: 01/09/2003
• Est. Priority Date: 02/02/2000
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Aigner, Robert, Plotz, Florian, Michaelis, Sven
• Granted Patent: US 6,734,770 B2
• Time in Patent Office: Days
• US Class Current: 335/78
• CPC Class Codes: H01H 1/20 Bridging contacts for circuit breakers H01H73/045
• CPC Class Codes: H01H 2059/0054 Rocking contacts or actuating members
• CPC Class Codes: H01H 59/0009 making use of micromechanics

Abstract

A microrelay has a switching part which is pivotably suspended on a substrate and can be moved into two alternative switching states like a rocker, by electrostatic attraction through the use of suitably attached electrodes. The switching function is brought about by electrodes which are fastened to the substrate above the rocker being shorted by metallizations or contact electrodes on an upper side of the switching part.

Claims

1. An electrostatically operating microrelay, comprising:

a substrate;

a switching part movably attached on said substrate and having a side facing away from said substrate, said switching part acting as a rocker moving between two alternative switching positions;

a contact electrode attached on said substrate and having two parts provided with separate electrical terminals;

a contact electrode attached to said switching part;

an actuator electrode disposed at said switching part;

two actuator electrodes attached on said substrate;

said actuator electrodes attached on said substrate being disposed relative to said actuator electrode attached to said switching part to bring about a rocking movement of said switching part into another of said two alternative switching positions by alternately applying an electric potential to said actuator electrodes attached on said substrate; and

said contact electrode attached on said substrate being disposed at said side of said switching part facing away from said substrate, permitting said contact electrode attached to said switching part to short said two parts of said contact electrode attached on said substrate in one of said switching positions.

2. The microrelay according to claim 1, which further comprises:

another contact electrode attached to said switching part; and

another contact electrode attached on said substrate, having two parts provided with separate electrical terminals and disposed on said side of said switching part facing away from said substrate;

said contact electrodes attached to said switching part each shorting said two parts of a respective one of said contact electrodes attached on said substrate, in each of said switching positions of said switching part.

3. The microrelay according to claim 1, wherein said switching part is formed of a material selected from the group consisting of polysilicon, monosilicon and SiGe, and said contact electrode attached to said switching part is formed of metal applied to said switching part.

4. The microrelay according to claim 3, wherein said actuator electrode disposed at said switching part is formed of an implanted dopant.

5. The microrelay according to claim 1, which further comprises an electrically insulating layer between said switching part and said contact electrode attached to said switching part.

6. The microrelay according to claim 1, which further comprises an anchorage fastened on said substrate, and struts aligned along a pivot axis, forming torsion springs and suspending said switching part on said anchorage.

7. The microrelay according to claim 1, wherein said actuator electrodes attached to said substrate are disposed between said substrate and said switching part.

8. The microrelay according to claim 1, wherein said actuator electrodes attached to said substrate are disposed on said side of said switching part facing away from said substrate.

9. The microrelay according to claim 1, wherein at least one of said actuator electrodes attached to said substrate is disposed between said substrate and said switching part and at least one of said actuator electrodes attached to said substrate is disposed on said side of said switching part facing away from said substrate.

10. The microrelay according to claim 8, wherein at least one of said actuator electrodes disposed on said side of said switching part facing away from said substrate is bridge-shaped and spans said switching part.

11. The microrelay according to claim 9, wherein at least one of said actuator electrodes disposed on said side of said switching part facing away from said substrate is bridge-shaped and spans said switching part.