METHOD OF MANUFACTURING A PROCESSING APPARATUS

• US 20030010446A1
• Filed: 04/14/2000
• Published: 01/16/2003
• Est. Priority Date: 04/16/1999
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation, Tokyo Electron Limited
• Original Assignee: Hitachi, Ltd., Tokyo Electron Limited
• Inventors: Aiba, Yasushi, Nakatsuka, Sakae, Kajiyama, Morio
• Granted Patent: US 6,625,862 B2
• Time in Patent Office: Days
• US Class Current: 156/345.1
• CPC Class Codes: C23C 16/4404 Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
• CPC Class Codes: Y10T 29/49885 with coating before or during assembling
• CPC Class Codes: Y10T 29/49886 to roughen surface

Abstract

A wafer processing apparatus (14) has a wafer processing vessel (16). A wafer is mounted on a susceptor (22) included in the wafer processing apparatus. Process gases are supplied to the wafer through a shower head (74) disposed in an upper region within the processing vessel to carry out a predetermined process for processing the wafer. The surfaces of aluminum members (16, 74) employed in the wafer processing apparatus are subjected to an organic mechanical chemical polishing process, a blasting process and an aluminum oxide film forming process in that order. It is difficult for unnecessary films to adhere to the thus treated surfaces and it is difficult for unnecessary films deposited on the thus treated surfaces to come off the surfaces. Consequently, intervals between cleaning operations can be extended and production of particles can be suppressed.

Claims

1. A processing apparatus comprising:

a processing vessel capable of being evacuated;

a susceptor disposed inside the processing vessel to support a workpiece thereon;

a shower head disposed in an upper region within the processing chamber to supply process gases toward the workpiece supported on the susceptor for processing the workpiece for a predetermined process; and

aluminum members exposed to an interior of the processing vessel;

wherein the aluminum members have surfaces processed by an organic mechanical chemical polishing process, a blasting process and an anodic aluminum oxide film forming process in that order.

2. The processing apparatus according to claim 1, wherein the aluminum members are included in at least one of the processing vessel and the shower head.

3. The processing apparatus according to claim 1, wherein the aluminum members are those forming a surface of at least one of the processing vessel and the shower head.

4. The processing apparatus according to claim 1, wherein a process to be carried out:

in the processing vessel is a film forming process.

5. A method of manufacturing a processing apparatus comprising:

a processing vessel capable of being evacuated;

a susceptor disposed inside the processing vessel to support a workpiece thereon;

a shower head disposed in an upper region within of the processing chamber to supply process gases toward the workpiece supported on the susceptor for processing the workpiece for a predetermined process; and

aluminum members exposed to an interior of the processing vessel;

said method comprising the steps of;

subjecting a surface of at least one of said aluminum members to an organic mechanical chemical polishing process;

then subjecting said surface to a blasting process;

thereafter subjecting said surface to an anodic aluminum oxide film forming process; and

applying the aluminum members thus processed by those processes in the processing vessel.

6. The method according to claim 5, wherein the organic mechanical chemical polishing process is a mechanical polishing process using a fluid prepared by mixing an organic solvent and abrasive grains.

7. The method according to claim 5, wherein the anodic aluminum oxide film forming process is a process for anodic oxidation of aluminum using an electrolytic solution.

8. The method according to claim 5, wherein the blasting process is followed by an etching process for etching the surfaces of the aluminum members with a solvent.