Shower head of a wafer treatment apparatus having a gap controller
First Claim
1. A shower head for supplying a reactant gas to a process region within a reaction chamber during manufacture of a semiconductor device, the shower head comprising:
- a top plate having a gas port for introducing the reactant gas supplied from an outside source into the reaction chamber;
a face plate disposed opposite the process region, the face plate having a plurality of through holes;
a first baffle plate, having a plurality of through holes, the first baffle plate disposed between the top plate and the face plate so that it is capable of moving up or down, the first baffle plate having a top surface that defines a first gap for forming a first lateral flow passage of the reactant gas;
a second baffle plate, having a plurality of through holes, the second baffle plate disposed between the first baffle plate and the face plate so that it is capable of moving up or down, the second baffle plate having a top surface that defines a second gap for forming a second lateral flow passage of the reactant gas between the first and second baffle plates; and
a gap controller for determining a width of the first gap and a width of the second gap.
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Accused Products
Abstract
A shower head for adjusting distribution of a reactant gas in a process region of a semiconductor manufacturing reaction chamber, wherein a top plate has a gas port for introducing the reactant gas into the reaction chamber; a face plate, having through holes, disposed opposite the process region; a first baffle plate, having through holes, disposed between the top plate and the face plate and capable of moving up or down, wherein the first baffle plate has a top surface that defines a first gap for forming a first lateral flow passage; a second baffle plate, having through holes, disposed between the first baffle plate and the face plate and capable of moving up or down, wherein the second baffle plate has a top surface that defines a second gap for forming a second lateral flow passage; and a gap controller for determining widths of the first and second gaps.
489 Citations
108 Claims
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1. A shower head for supplying a reactant gas to a process region within a reaction chamber during manufacture of a semiconductor device, the shower head comprising:
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a top plate having a gas port for introducing the reactant gas supplied from an outside source into the reaction chamber;
a face plate disposed opposite the process region, the face plate having a plurality of through holes;
a first baffle plate, having a plurality of through holes, the first baffle plate disposed between the top plate and the face plate so that it is capable of moving up or down, the first baffle plate having a top surface that defines a first gap for forming a first lateral flow passage of the reactant gas;
a second baffle plate, having a plurality of through holes, the second baffle plate disposed between the first baffle plate and the face plate so that it is capable of moving up or down, the second baffle plate having a top surface that defines a second gap for forming a second lateral flow passage of the reactant gas between the first and second baffle plates; and
a gap controller for determining a width of the first gap and a width of the second gap. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69)
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56. A shower head for supplying a reactant gas to a process region within a reaction chamber, the shower head comprising:
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a top plate having a gas port for introducing the reactant gas supplied from an outside source into the reaction chamber;
a face plate disposed opposite the process region, the face plate having a plurality of through holes;
a first baffle plate disposed between the top plate and the face plate, the first baffle plate having a plurality of through holes;
a second baffle plate, having a plurality of through holes, disposed between the first baffle plate and the face plate, the second baffle plate having a top surface that defines a gap for forming a lateral flow passage of the reactant gas between the first and second baffle plates;
a plurality of piezoelectric elements disposed on the second baffle plate for controlling the amount of the reactant gas through the gap; and
a power supply unit for applying voltage to each of the plurality of piezoelectric elements.
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70. A shower head for supplying a reactant gas to a process region within a reaction chamber, the shower head comprising:
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a first baffle plate having a plurality of first and second through holes in order to selectively adjust the amount of the reactant gas supplied from an outside source according to a radius from the central axis, wherein the plurality of first through holes are spaced apart from a central axis by a first radius and the plurality of second through holes are spaced apart from the central axis by a second radius;
a second baffle plate disposed below the first baffle plate so that a gap for providing a lateral flow passage is formed between the first and second baffle plates, the second baffle plate having a plurality of through holes; and
a gap controller for moving at least one of the first and second baffle plates in order to adjust the width of the gap. - View Dependent Claims (71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92)
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93. A shower head comprising:
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a circular first baffle plate having a plurality of through holes;
a circular second baffle plate disposed below the first baffle plate with a gap having a predetermined width interposed between the first and second baffle plates, the second baffle plate having a plurality of through holes; and
a plurality of piezoelectric elements disposed between the first and second baffle plates for controlling the amount of a reactant gas flowing through the plurality of through holes formed in the first baffle plate. - View Dependent Claims (94, 95, 96, 97, 98, 99, 100, 101, 102, 103, 104, 105, 106, 107, 108)
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Specification