Active matrix substrate and method of manufacturing the same

• US 20030010970A1
• Filed: 07/09/2002
• Published: 01/16/2003
• Est. Priority Date: 07/10/2001
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Nakajima, Mitsuo, Hara, Yujiro, Hioki, Tsuyoshi, Onozuka, Yutaka, Akiyama, Masahiko
• Granted Patent: US 6,828,657 B2
• Time in Patent Office: Days
• US Class Current: 257/9
• CPC Class Codes: G02F 1/13613 the semiconductor element being formed on a first substrate and thereafter transferred to the final cell substrate
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 2924/01055 Cesium [Cs]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device

Abstract

An active matrix substrate comprises a substrate, a position control member provided on the substrate and surrounding a specific space by a sidewall thereof to expose a surface of the substrate and whose inner side face inclines at a specific angle with respect to the substrate, an active element provided so as to engage with the inner side face of the position control member and whose outer side face has at least a part that inclines at substantially the same angle as the specific angle of the inner side face of the position control member with respect to the substrate, and an adhesion section which bonds the active element to the substrate or the position control member and whose wettability with the position control member is lower than that of the adhesive with the substrate.

Claims

1. An active matrix substrate comprising:

a substrate;

a position control member provided on said substrate and surrounding a specific space by a sidewall thereof to expose a top surface of said substrate and whose inner side face inclines at a specific angle with respect to said substrate;

an active element provided so as to engage with said inner side face of said position control member and whose outer side face has at least a part that inclines at substantially the same angle as said specific angle of said inner side face of said position control member with respect to said substrate; and

an adhesion section which includes an adhesive that bonds said active element to said substrate or said position control member and whose wettability with said position control member is lower than that of said adhesive with said substrate.

2. The active matrix substrate according to claim 1, wherein said wettability is defined as a contact angle of said adhesive to said position control member or said substrate and

said contact angle of said adhesive to said position control member is 70°

or more.

3. The active matrix substrate according to claim 1, wherein said active element includes an etching stopper layer provided on a bottom surface thereof.

4. The active matrix substrate according to claim 1, wherein said position control member has at least one cut or through hole in said sidewall.

5. The active matrix substrate according to claim 1, wherein said active element has a shape out of rotation symmetry.

6. The active matrix substrate according to claim 1, wherein said angle of said inclined part of said outer side face of said active element is the same as said specific angle of inclination of said inner side face of said position control member.

7. The active matrix substrate according to claim 1, wherein a height from said top surface of said substrate to a top surface of said active element is equal to or larger than a height from said top surface of said substrate to a top surface of said position control member.

8. The active matrix substrate according to claim 1, wherein said height from said top surface of said substrate to a top surface of said position control member is equal to 0.3 μ

m or more and 5 μ

m or less.

9. An active matrix substrate comprising:

a substrate;

a position control member provided on a top surface of said substrate and has a concave part that is made up of an inner side face inclining at a specific angle with respect to said substrate and a bottom part connecting to said inner side face;

an active element provided so as to engage with said concave part of said position control member and whose outer side face has at least a part that inclines at substantially the same angle as said specific angle of said inner side face of said position control member; and

an adhesion section which includes an adhesive that bonds said active element to said position control member, with a contact angle of said adhesive to said position control member being 70°

or more.

10. The active matrix substrate according to claim 9, wherein said active element includes an etching stopper layer provided on a bottom surface thereof.

11. The active matrix substrate according to claim 9, wherein said position control member has at least one cut or through hole in a sidewall of said concave part.

12. The active matrix substrate according to claim 9, wherein said active element has a shape out of rotation symmetry.

13. The active matrix substrate according to claim 9, wherein said angle of said inclined part of said outer side face of said active element is the same as said specific angle of inclination of said inner side face of said position control member.

14. The active matrix substrate according to claim 9, wherein a height from said top surface of said substrate to a top surface of said active element is equal to or larger than a height from said top surface of said substrate to a top surface of said position control member.

15. The active matrix substrate according to claim 9, wherein said height from said top surface of said substrate to a top surface of said position control member is equal to 0.3 μ

m or more and 5 μ

m or less.

17. The method according to claim 16, wherein said forming said active element includes providing an etching stopper layer on said bottom surface of said active element.

18. The method according to claim 16, wherein said forming said active element includes forming said active element in such a manner that said element has a shape out of rotational symmetry.

19. The method according to claim 16, wherein said forming said position control member on a third substrate includes forming said position control member in such a manner that said member has an annular shape with an opening in a center portion thereof.

20. The method according to claim 16, wherein said forming said position control member on a third substrate includes forming said position control member in such a manner that said member has a concave shape with a bottom part connected to said sidewall.

21. The method according to claim 16, wherein said forming said position control member on a third substrate includes making at least one cut or through hole in said sidewall which links an inside and an outside of said sidewall.

22. The method according to claim 16, wherein said forming said position control member on a third substrate includes equalizing said second inclination with respect to said third substrate to said first inclination with respect to said bottom surface of said active element.

23. The method according to claim 16, wherein, when said wettability is defined as a contact angle of said adhesive to said position control member, said applying an adhesive includes setting said contact angle of said adhesive to said position control member to 70°

or more.

16. A method of manufacturing active matrix substrates, comprising:

forming an active element on a first substrate;

transferring said active element to a second substrate;

processing said active element in such a manner that an outer side face of said active element has a first inclination with respect to a bottom surface thereof;

forming on a third substrate a position control member which surrounds a specific space by a sidewall thereof and an inner side face of said position control member has a second inclination with respect to said third substrate;

applying an adhesive to a face exposed to said specific space in said position control member, wettability of said adhesive to said position control member being lower than that of said adhesive to said third substrate; and

engaging said active element with said position control member at said specific space and bonding said active element with said adhesive.