Light emitting semiconductor device with a surface-mounted and flip-chip package structure
First Claim
1. A light emitting semiconductor device with a surface-mounted and flip-chip package structure, said device comprising:
- an insulating substrate;
a LED, including;
a substrate;
a first-type semiconductor layer formed on said substrate;
a first electrode formed on part of the surface of said first semiconductor layer;
a second-type semiconductor layer formed on the surface of said first-type semiconductor layer, therein said second-type semiconductor layer does not cover said first electrode; and
a second electrode formed on the surface of said second-type semiconductor layer;
two solder bumps, formed on the surface of said insulating substrate, the first and second electrodes of said LED are mounted onto the surface of said insulating substrate via said two solder bumps respectively; and
two electrode layers, positioned on the two sides of said insulating substrate and extended upwardly and downwardly to the upper and lower surface of said insulating substrate, and the upper part of said two electrode layers are electrically connected with the first and second electrodes of said LED via said two solder bumps.
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Accused Products
Abstract
A light emitting semiconductor device with a surface-mounted and flip-chip package structure is disclosed. The light emitting semiconductor device includes an insulating substrate and a LED. The LED includes a substrate, a first-type semiconductor layer, a first electrode formed on part of the first-type semiconductor layer surface, a second-type semiconductor layer formed on the first-type semiconductor layer surface but not covering the first electrode, and a second electrode formed on the second-type semiconductor layer. Two electrode layers are formed on the two sides of the insulating substrate and extend upwardly and downwardly to the upper and lower surface of the insulating substrate. The device is characterized in that the LED is mounted on the insulating substrate by a flip chip method and the insulating substrate is formed with two electrode layers at both side walls to surface-mounted with the LED.
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Citations
20 Claims
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1. A light emitting semiconductor device with a surface-mounted and flip-chip package structure, said device comprising:
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an insulating substrate;
a LED, including;
a substrate;
a first-type semiconductor layer formed on said substrate;
a first electrode formed on part of the surface of said first semiconductor layer;
a second-type semiconductor layer formed on the surface of said first-type semiconductor layer, therein said second-type semiconductor layer does not cover said first electrode; and
a second electrode formed on the surface of said second-type semiconductor layer;
two solder bumps, formed on the surface of said insulating substrate, the first and second electrodes of said LED are mounted onto the surface of said insulating substrate via said two solder bumps respectively; and
two electrode layers, positioned on the two sides of said insulating substrate and extended upwardly and downwardly to the upper and lower surface of said insulating substrate, and the upper part of said two electrode layers are electrically connected with the first and second electrodes of said LED via said two solder bumps. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification