Exposure system, device production method, semiconductor production factory, and exposure apparatus maintenance method

• US 20030013213A1
• Filed: 07/02/2002
• Published: 01/16/2003
• Est. Priority Date: 07/10/2001
• Status: Active Grant

• Current Assignee: Canon Ayutthaya Limited (Canon Inc.)
• Original Assignee: Canon Ayutthaya Limited (Canon Inc.)
• Inventors: Takano, Shin
• Granted Patent: US 6,889,014 B2
• Time in Patent Office: Days
• US Class Current: 438/14
• CPC Class Codes: G03F 7/70516 Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
• CPC Class Codes: G03F 7/70525 Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
• CPC Class Codes: G03F 7/708 Construction of apparatus, e.g. environment aspects, hygiene aspects or materials

Abstract

An exposure system includes a wafer processing apparatus for performing a preparation-for-exposure process on a wafer before an exposure process is performed, an exposure apparatus for performing the exposure process on the wafer subjected to the preparation-for-exposure process performed by the wafer processing apparatus, wherein the exposure apparatus also performs a calibration process to correct an error caused by a time-varying environmental parameter and/or caused by the exposure apparatus itself, and a host computer connected to the wafer processing apparatus and the exposure apparatus via communication means. Depending on the time needed for the wafer processing apparatus to perform the preparation-for-exposure process, the host computer outputs a calibration execution command for performing the calibration process to the exposure apparatus. Thereby, the total time from the start of processing a lot to the end thereof is minimized and thus, the total throughput is improved.

Claims

1. An exposure system comprising:

a wafer processing apparatus for performing a preparation-for-exposure process on a wafer before an exposure process is performed;

an exposure apparatus for performing the exposure process on the wafer subjected to the preparation-for-exposure process performed by the wafer processing apparatus, wherein the exposure apparatus also performs a calibration process to correct an error caused by at least one of (i) a time-varying environmental parameter and (ii) the exposure apparatus itself; and

a host computer connected to the wafer processing apparatus and the exposure apparatus via communication means, wherein, depending on the time needed for the wafer processing apparatus to perform the preparation-for-exposure process, the host computer outputs to the exposure apparatus a calibration execution command for performing the calibration process.

2. An exposure system according to claim 1, wherein the host computer determines whether the exposure apparatus can perform the complete calibration process before the exposure apparatus receives a wafer subjected to the preparation-for-exposure process by the wafer processing apparatus, and the host computer outputs the calibration execution command depending on the result of the determination.

3. An exposure system according to claim 1, wherein the host computer stores the time needed for the wafer processing apparatus to perform the preparation-for-exposure process and the time needed for the exposure apparatus to perform the calibration process, which are actually measured in advance.

4. An exposure system according to claim 1, wherein the exposure apparatus performs the calibration process (i) by a time at which a wafer to be first exposed is supplied to the exposure apparatus, (ii) when the exposure system is started or (iii) when a plurality of lots are successively processed.

5. An exposure system according to claim 1, wherein the calibration process includes at least one of a baseline calibration process, a focus calibration process, and a stage reference point calibration process.

6. An exposure system according to claim 1, wherein the exposure apparatus includes a plurality of wafer processing apparatuses and a plurality of exposure apparatuses, which are all connected to the host computer.

7. An exposure system according to claim 1, wherein the wafer processing apparatus includes a coater for coating a resist on a wafer, a cold plate for cooling a wafer, a hot plate for heating a wafer, and a wafer hand for transferring a wafer.

8. An exposure system according to claim 7, wherein the wafer processing apparatus further includes a developer for selectively removing a resist from a wafer subjected to the exposure process performed by the exposure apparatus.

9. An exposure system according to claim 1, wherein if the host computer determines that the exposure apparatus cannot complete all items of the calibration process by a time at which a wafer subjected to the preparation-for-exposure process performed by the wafer processing apparatus is supplied, the host computer selects one or more items of the calibration process and outputs a command to execute the selected items.

10. An exposure system according to claim 1, wherein the exposure apparatus includes a display, a network interface, and a computer for executing network driver software thereby establishing a computer network and allowing maintenance information of the exposure apparatus to be transmitted by means of data communication via the computer network.

11. An exposure system according to claim 10, wherein the network driver software provides on the display a user interface for accessing a maintenance database, which is provided by a vendor or a user of the exposure apparatus and which is connected to an external network of a factory in which the exposure apparatus is installed, thereby making it possible to acquire information from the database via the external network.

13. A method according to claim 12, wherein the communication means is a local area network installed in the semiconductor production factory, and the method further comprises transmitting data representing information associated with at least one of the apparatuses of the set of the production apparatuses between the local area network and an external network outside the semiconductor production factory.

14. A method according to claim 12, further comprising acquiring maintenance information of a production apparatus by performing data communication by accessing, via the external network, a database provided by a vendor or a user of the production apparatus.

15. A method according to claim 12, further comprising managing production by performing data communication, via the external network, between the semiconductor production factory and another, different, semiconductor production factory.

12. A method of producing a device, comprising the steps of:

providing, in a semiconductor production factory, a set of production apparatuses for performing processes, the set including an exposure apparatus and a wafer processing apparatus;

performing, by the wafer processing apparatus, a preparation-for-exposure process on a wafer before performing an exposure process;

performing, by the exposure apparatus, (i) the exposure process on the wafer subjected to the preparation-for-exposure process performed by the wafer processing apparatus, and (ii) a calibration process to correct an error caused by a time-varying environmental parameter or caused by the exposure apparatus itself; and

communicating the set of production apparatuses with a host computer via communication means,

wherein when a semiconductor device is produced by performing a plurality of processes using the set of the production apparatuses, the host computer controls the timing of the calibration process, taking into account an amount of time to perform processes by the exposure apparatus and an amount of time to perform processes by the wafer processing apparatus.

16. A semiconductor production factory comprising:

a set of production apparatuses for performing processes, the set including an exposure apparatus and a wafer processing apparatus, the wafer processing apparatus being provided for performing a preparation-for-exposure process on a wafer before performing an exposure process, and the exposure apparatus being provided for performing the exposure process on the wafer subjected to the preparation-for-exposure process performed by the wafer processing apparatus, wherein the exposure apparatus also performs a calibration process to correct an error caused by a time-varying environmental parameter or caused by the exposure apparatus itself;

a local area network for communicating the set of production apparatuses with a host computer, wherein, depending on the time needed for the wafer processing apparatus to perform the preparation-for-exposure process, the host computer outputs to the exposure apparatus a calibration execution command for performing the calibration process; and

gateway for making it possible to access an external network outside the factory from the local area network, so that information of at least one apparatus included in the set of apparatuses can be transmitted by means of data communication.

17. A method of maintaining an exposure, apparatus for performing an exposure process on a wafer subjected to a preparation-for-exposure process performed by a wafer processing apparatus, wherein the exposure apparatus also performs a calibration process to correct an error caused by at least one of (i) a time-varying environmental parameter and (ii) the exposure apparatus itself the exposure apparatus being installed in a semiconductor production factory, said method comprising the steps of:

providing, by a vendor or a user of the exposure apparatus, a maintenance database connected to an external network of the semiconductor production factory;

enabling the semiconductor production factory to access the maintenance database via the external network; and

transmitting maintenance information stored in the maintenance database to the semiconductor production factory via the external network.