Connection assembly for integrated circuit sensors

• US 20030013328A1
• Filed: 05/22/2002
• Published: 01/16/2003
• Est. Priority Date: 05/22/2001
• Status: Abandoned Application

• Current Assignee: Atrua Technologies Incorporated (Apple Inc.)
• Original Assignee: Atrua Technologies Incorporated (Apple Inc.)
• Inventors: Andrade, Thomas L.
• Application Number:
  US10/155,834
• Publication Number:
  US 20030013328A1
• Time in Patent Office: Days
• US Class Current: 439/76.1
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01R 12/62 connecting to rigid printed circuits or like structures
• CPC Class Codes: H05K 1/181 associated with surface mounted components

Abstract

An improved connection assembly for an integrated circuit sensor uses direct chip attachment to connect a circuit board directly to the integrated circuit. The circuit board covers and protects the integrated circuit except over the sensor areas. The use of a thin circuit board reduces the physical interference between the circuit board and the sensor area.

Claims

1. A connection assembly comprising:

an integrated circuit sensor;

a circuit board with both connection points that substantially match the locations of the integrated circuit sensor and openings in the circuit board primarily over the sensor area; and

connections between the matching connection points of the circuit board and the integrated circuit sensor.

2. The connection assembly in claim 1, wherein an insulating material is placed between circuit board and the integrated circuit sensor.

3. The connection assembly in claim 1, wherein the circuit board is also Mechanically attached to the backside of the integrated circuit sensor.

4. The connection assembly in claim 2, wherein the circuit board is also mechanically attached to the backside of the integrated circuit sensor.

5. A device comprising:

an integrated circuit;

a circuit board having a plurality of connection points that substantially match the locations of the integrated circuit and openings in the circuit board primarily over a predetermined area;

connections between the matching connection points of the circuit board and the integrated circuit;

an insulating material is placed between circuit board and the integrated circuit; and

the circuit board is mechanically attached to the backside of the integrated circuit.

6. The device in claim 5, wherein the integrated circuit includes a sensor and the predetermined area comprises an area of said sensor.

7. A method for making the electrical and physical connection between an integrated circuit sensor and an electronic system.