Method and device for testing electronic devices
First Claim
1. A burn-in board for use in testing semiconductor chips at elevated temperatures comprising a steel base having a dielectric coating formed thereon, said dielectric coating having a circuit formed thereon, said circuit having a connector region for attachment to an external electrical source and a mounting region for mounting sockets for supporting said chips, said burn-in board having a leakage current of less than 10μ
- Amps at 350°
C.
1 Assignment
0 Petitions
Accused Products
Abstract
The present invention provides a new electronic circuit board and a method of using such board to test electronic devices at elevated temperatures. The board comprises a steel base having a dielectric coating layer and a circuit formed on the layer. The circuit includes a connector region for attachment to an external electrical source and a mounting region for mounting sockets for supporting, powering and monitoring the electronic devices during elevated temperature testing. The board displays a leakage current of less than 10μ Amps at 350° C.
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Citations
16 Claims
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1. A burn-in board for use in testing semiconductor chips at elevated temperatures comprising a steel base having a dielectric coating formed thereon, said dielectric coating having a circuit formed thereon, said circuit having a connector region for attachment to an external electrical source and a mounting region for mounting sockets for supporting said chips, said burn-in board having a leakage current of less than 10μ
- Amps at 350°
C. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
- Amps at 350°
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10. A method of conducting the high temperature testing of an electronic device comprising the steps of:
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(i) providing an electronic circuit board for supporting and supplying current to the device to be tested, said electronic circuit board comprising a steel base coated with a dielectric material coating;
(ii) providing electric current to the electronic circuit board; and
(iii) heating the electronic circuit board to a temperature of from about 350°
C. to about 500°
C. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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Specification