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Method of depositing a thin metallic film and related apparatus

  • US 20030016116A1
  • Filed: 07/23/2001
  • Published: 01/23/2003
  • Est. Priority Date: 07/23/2001
  • Status: Abandoned Application
First Claim
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1. A method of depositing a thin metallic film comprising:

  • a. depositing a layer of etchable metal onto a substrate;

    b. applying a photoresist to the etchable metal layer;

    c. developing the photoresist to expose selected portions of the etchable metal layer;

    d. etching the exposed portions of the etchable metal layer to expose selected portions of the substrate;

    e. depositing a metallic material on the exposed substrate while substantially preventing carbonization of the photoresist during deposition of the metallic material;

    f. removing the remaining photoresist; and

    g. removing the remaining etchable metal layer.

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