Method of depositing a thin metallic film and related apparatus
First Claim
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1. A method of depositing a thin metallic film comprising:
- a. depositing a layer of etchable metal onto a substrate;
b. applying a photoresist to the etchable metal layer;
c. developing the photoresist to expose selected portions of the etchable metal layer;
d. etching the exposed portions of the etchable metal layer to expose selected portions of the substrate;
e. depositing a metallic material on the exposed substrate while substantially preventing carbonization of the photoresist during deposition of the metallic material;
f. removing the remaining photoresist; and
g. removing the remaining etchable metal layer.
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Abstract
A method of depositing a thin metal film using photolithography is disclosed. The method includes the deposition of a sacrificial metal layer on a substrate. Photolithography processing forms a pattern on the sacrificial metal layer that is removed prior to sputter deposition of the thin metal film.
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Citations
51 Claims
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1. A method of depositing a thin metallic film comprising:
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a. depositing a layer of etchable metal onto a substrate;
b. applying a photoresist to the etchable metal layer;
c. developing the photoresist to expose selected portions of the etchable metal layer;
d. etching the exposed portions of the etchable metal layer to expose selected portions of the substrate;
e. depositing a metallic material on the exposed substrate while substantially preventing carbonization of the photoresist during deposition of the metallic material;
f. removing the remaining photoresist; and
g. removing the remaining etchable metal layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 19, 20, 21, 22, 23, 24, 25, 26, 27, 29, 30, 31, 32, 33, 34, 35, 36, 37, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50)
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18. A method of depositing a thin metallic film comprising:
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a. depositing a layer of copper onto a substrate;
b. applying a positive photoresist to the copper layer;
c. softbaking the photoresist;
d. exposing the photoresist through a photomask;
e. developing the photoresist to expose a portion of the copper layer;
f. chemically etching the exposed copper layer with nitric acid to expose a portion of the substrate;
g. depositing a metallic material on the exposed substrate while substantially preventing photoresist carbonization during deposition of the metallic material;
h. removing the remaining photoresist; and
i. removing the remaining copper. - View Dependent Claims (51)
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28. A strain gauge comprising a meandering arrangement of grid lines, said grid lines comprising a thin film of a photolithographically deposited metal.
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38. A thin film thermocouple comprising:
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a substrate;
a first thin film of photolithographically deposited metal on said substrate; and
a second thin film of a photolithographically deposited metal on said substrate;
said first and second films arranged to form a thermocouple.
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Specification