Panel display device and method for forming protective layer within the same

• US 20030017297A1
• Filed: 07/17/2002
• Published: 01/23/2003
• Est. Priority Date: 07/20/2001
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Electronics, Inc. (LG Corporation)
• Inventors: Song, Won Jun, Yang, Jung Hwan
• Granted Patent: US 6,872,473 B2
• Time in Patent Office: Days
• US Class Current: 428/68
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 59/00 Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
• CPC Class Codes: H10K 59/80 Constructional details
• CPC Class Codes: H10K 59/8731 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: Y10S 428/917 Electroluminescent
• CPC Class Codes: Y10T 428/23 Sheet including cover or casing
• CPC Class Codes: Y10T 428/239 Complete cover or casing
• CPC Class Codes: Y10T 428/26 Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
• CPC Class Codes: Y10T 428/3154 Of fluorinated addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31935 Ester, halide or nitrile of addition polymer

Abstract

A panel display device and a method for forming a protective layer within the same are disclosed, in which protective layers having a multi-layered sealing structure are provided to avoid any degradation caused by an external factor such as O₂ or moisture. The panel display device includes a substrate, an organic EL layer formed on the substrate, a barrier dividing the organic EL layer, and a multi-layered protective layer formed on the organic EL layer.

Claims

1. A panel display device comprising:

a substrate;

an organic EL(electroluminescence) layer formed on the substrate;

a barrier dividing the organic EL layer; and

a multi-layered protective layer formed on the organic EL layer.

2. The panel display device of claim 1, wherein the device has a sealing structure.

3. The panel display device of claim 1, wherein the multi-layered protective layer includes a first protective layer formed of a high polymer compound containing fluorine at the lowest part, a second protective layer formed of a silicon composite, a third protective layer formed of a compound hardened by polymerization at a room temperature and a normal pressure, and a fourth protective layer formed of a number of layers adhered to one another at the most upper part.

4. The panel display device of claim 3, wherein the first protective layer is formed of poly-chloro-trifluoro-ethylene, poly-dichloro-trifluoro-ethylene, chloro-trifluoro-ethylene, dichloro-trifluoro-ethylene, or a co-polymer of chloro-trifluoro-ethylene and dichloro-trifluoro-ethylene.

5. The panel display device of claim 3, wherein the first protective layer is formed of a high polymer compound having a molecular weight within the range of 1,000 gram/mole to 300,000 gram/mole.

6. The panel display device of claim 5, wherein the first protective layer is formed of a high polymer compound having a molecular weight within the range of 1,000 gram/mole to 3,000 gram/mole.

7. The panel display device of claim 3, wherein the first protective layer has a thickness of 0.1˜

10 μ

m.

8. The panel display device of claim 3, wherein the second protective layer is formed or co-deposited using SiC, SiO, SiO₂, or Si_XN_Y (X and Y are natural numbers).

9. The panel display device of claim 3, wherein the second protective layer includes any one of Cs, CaO, Na, Li, Mg and K within the range of 1˜

10%.

10. The panel display device of claim 3, wherein the third protective layer is formed of an epoxy based compound, silicon compound, or acrylate based compound.

11. The panel display device of claim 3, wherein the third protective layer is formed of a compound having low volatility and high melting point, which is hardened by polymerization at a room temperature and a normal pressure.

12. The panel display device of claim 3, wherein the third protective layer is formed of an acrylate based compound having a long chain structure.

13. The panel display device of claim 3, wherein the third protective layer is formed of trimethyl propane triacrylate, ditrimethylolpropane tetraacrylate, or trimethylacrylate.

14. The panel display device of claim 3, wherein the third protective layer is formed of RT-glass or a silicon sealant to form a transparent layer.

15. The panel display device of claim 3, wherein the fourth protective layer has a three-layered structure including glass or high polymer film.

16. The panel display device of claim 3, wherein the fourth protective layer has the most upper layer which is formed of polyethylene terephthalate (PET), poly methyl methacrylate (PMMA), or fluorine based high polymer compound.

17. The panel display device of claim 16, wherein the fourth protective layer has the most upper layer which is formed of a compound having a molecular weight within the range of 20,000 gram/mole to 250,000 gram/mole.

18. The panel display device of claim 16, wherein the fourth protective layer has the most upper layer which is formed with a thickness of 100˜

1000 μ

m.

19. The panel display device of claim 16, wherein the fourth protective layer has the most upper layer which is formed of glass of a low melting temperature.

20. The panel display device of claim 16, wherein the layer below the most upper layer is treated with plasma.

21. The panel display device of claim 3, wherein the fourth protective layer has the lowest layer which is formed of an organic material, metal oxide, organic-inorganic hybrid, or metal complex.

22. The panel display device of claim 3, wherein the first protective layer is formed by the steps of depositing an organic material by using the PVD (physical vapor deposition) and irradiating ultraviolet (UV) light into the organic material.

23. The panel display device of claim 22, wherein the organic material is one of stearyl acrylate, lauryl acrylate, 2-phenoxyethyl acrylate, isodecyl acrylate, isooctyl acrylate, iso bornyl acrylate, 1,3-butylene glycol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, ethoxylated bisphenol A diacrylate, propoxylated neophentyl glycol diacrylate, tris(2-hydroxylethyl) isocyannurate triacrylate, and trimethylolpropane tracrylate.

24. The panel display device of claim 3, wherein the first protective layer is formed by growing a high polymer thin film using the PECVD(plasma enhanced chemical vapor deposition) by using a florine based gas and a carbon compound.

25. The panel display device of claim 24, the florine based gas is one of CF₄, C₂F₄, C₂F₅H, C₂F₄H₂, and NF₃.

26. The panel display device of claim 25, high polymer thin film has a net structure, such as Teflon by using the florine based gas.

27. The panel display device of claim 24, the carbon compound is one of benzene, naphthalene, and acetylene.

29. The method of claim 28, wherein the first protective layer in the step a) is formed by physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma enhanced CVD (PECVD), or sputtering.

30. The method of claim 29, wherein the high polymer compound containing fluorine is deposited at 0.1˜

10 nm/s using the PVD.

31. The method of claim 30, wherein the high polymer compound is deposited at a temperature of 50˜

100°

C. of the substrate.

32. The method of claim 28, wherein the second protective layer in the step b) is formed by E-beam deposition or plasma enhanced CVD(PECVD).

33. The method of claim 32, wherein the step b) includes co-depositing Cs on the silicon composite at a concentration of 1˜

10% to give moisture absorption to the second protective layer.

34. The method of claim 28, wherein the step c) includes depositing the compound hardened by polymerization at a room temperature and a normal pressure using the PVD and hardening the same by irradiating ultraviolet (UV).

35. The method of claim 28, wherein the step c) includes coating either epoxy based compound hardened by polymerization at a room temperature and a normal pressure or silicon compound using spin-coating, spray method, or Dr. Blade method.

36. The method of claim 23, wherein the step d) includes:

forming a third layer at the lowest part using organic material, metal oxide, organic-inorganic hybrid, or metal complex;

forming a second layer treated with plasma, on the third layer to enhance adhesion with the third protective layer; and

forming a first layer of PET, PMMA, fluorine based high polymer compound, or glass of a low melting temperature.

37. The method of claim 36, wherein the third layer is formed by gas absorption of the organic material, the metal oxide, the organic-inorganic hybrid, or the metal complex using the PVD, the CVD, or the PECVD.

28. A method for forming a multi-layered protective layer in a panel display device including a substrate, an organic electroluminescence layer, a barrier, and the multi-layered protective layer, the method comprising:

a) forming a first protective layer of a high polymer compound containing fluorine at the lowest part;

b) forming a second protective layer of a silicon composite on the first protective layer;

c) forming a third protective layer of a compound on the second protective layer, the compound being hardened by polymerization at a room temperature and a normal pressure; and

d) forming a fourth protective layer on the third protective layer, the fourth protective layer having a number of layers adhered to one another.