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Integrated circuit die having an interference shield

  • US 20030017646A1
  • Filed: 09/13/2002
  • Published: 01/23/2003
  • Est. Priority Date: 02/16/2001
  • Status: Active Grant
First Claim
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1. An integrated circuit package, comprising:

  • an integrated circuit including a first circuit, and at least one second circuit, the first circuit being surrounded on lateral sides by a plurality of conductive vias; and

    a package substrate having a ground plane, whereby the conductive vias and ground plane protect the second circuit from electromagnetic interference from the first circuit.

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