Thermal management systems and methods

• US 20030020072A1
• Filed: 07/25/2001
• Published: 01/30/2003
• Est. Priority Date: 07/25/2001
• Status: Abandoned Application

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Higgins, Robert J.
• Application Number:
  US09/911,518
• Publication Number:
  US 20030020072A1
• Time in Patent Office: Days
• US Class Current: 257/78
• CPC Class Codes: H01L 21/02197 the material having a perovskite structure, e.g. BaTiO3
• CPC Class Codes: H01L 21/02381 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/02488 Insulating materials
• CPC Class Codes: H01L 21/02505 consisting of more than two layers
• CPC Class Codes: H01L 21/02513 Microstructure
• CPC Class Codes: H01L 21/02521 Materials
• CPC Class Codes: H01L 21/31691 with perovskite structure
• CPC Class Codes: H01L 23/38 Cooling arrangements using the Peltier effect
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H10N 19/00 Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A thermal management system or method may include features for pumping heat in a composite semiconductor structure. A heat pump such as a peltier device may be formed from compound semiconductor materials in a composite semiconductor structure. The heat pump may be thermally connected to an area of thermal interest such as a circuit device that generates heat during operation. The heat pump may also be connected to a non-compound semiconductor region of the composite semiconductor structure, which may be die bonded to a heat sink. Electricity may be conducted through the heat pump to move heat in a desired direction between the area of thermal interest and the non-compound semiconductor region. Plural heat pumps may be formed for cooling or heating an area of thermal interest in the composite semiconductor structure. If desired, control circuitry and a temperature sensor may be formed and used to regulate the temperature in the area of the thermal interest.

Claims

1. A composite semiconductor structure with thermal management, comprising:

a non-compound semiconductor region;

an accommodating layer;

a compound semiconductor region that is integrated with the non-compound semiconductor region through the accommodating layer; and

a heat pump device comprising;

a portion of the compound semiconductor region through which electricity is conducted to move heat through the Peltier effect; and

an interconnect that has a lower thermal resistivity than that of the compound semiconductor region and that is adapted to carry heat approximately between the portion and an area of thermal interest in the composite semiconductor structure that is electrically insulated from the interconnect.

2. The composite semiconductor structure of claim 1 comprising plural ones of the portion through which electricity is conducted to move heat through the Peltier effect and plural ones of the interconnect.

3. The composite semiconductor structure of claim 1 wherein the non-compound semiconductor region is adapted to receive a heat sink.

4. The composite semiconductor structure of claim 3 wherein the interconnect is electrically connected to the heat pump device to apply electricity to the portion.

5. The composite semiconductor structure of claim 1 wherein the non-compound semiconductor region has a lower thermal resistivity than that of the compound semiconductor region.

6. The composite semiconductor structure of claim 1 further comprising additional interconnect that has a lower resistivity than that of the compound semiconductor region and that is adapted to carry heat approximately between the portion and the non-compound semiconductor region, wherein together the interconnect, the portion, and the additional interconnect form a thermal path approximately between the area of thermal interest and the non-compound semiconductor region.

7. The composite semiconductor structure of claim 1 wherein the additional interconnect is adapted to apply electricity to the portion.

8. The composite semiconductor structure of claim 1 further comprising a temperature sensor in close thermal proximity to the area of thermal interest in the composite semiconductor structure.

9. The composite semiconductor structure of claim 8 further comprising control circuitry that controls when the heat pump device is operating.

10. The composite semiconductor structure of claim 9 wherein the control circuitry temperature regulates the area of thermal interest based on information from the temperature sensor.

11. The composite semiconductor structure of claim 8 wherein the temperature sensor is a diode.

12. The composite semiconductor structure of claim 1 wherein the non-compound semiconductor region is a monocrystalline Group IV semiconductor region.

13. The composite semiconductor structure of claim 1 wherein the non-compound semiconductor region is a silicon region.

14. The composite semiconductor structure of claim 1 wherein the compound semiconductor region is a monocrystalline Group 111-V semiconductor region.

15. The composite semiconductor structure of claim 1 wherein the compound semiconductor region is a region of gallium arsenide.

16. A method of thermal management, comprising:

forming a composite semiconductor structure that comprises a non-compound semiconductor region, an accommodating layer, and a compound semiconductor region that is integrated with the non-compound semiconductor region through the accommodating layer, the composite semiconductor structure comprising a heat pump device that is formed at least partly from a portion of the compound semiconductor region;

thermally connecting the portion with an area of thermal interest through an interconnect that has a lower thermal resistivity than that of the compound semiconductor region and is electrically insulated from the area of thermal interest; and

conducting electricity through the portion to move heat between the heat pump and the area of thermal interest.

17. The method of claim 16 wherein the forming comprises forming a composite semiconductor structure that includes plural ones of the portion, and wherein the thermally connecting comprises thermally connecting the portions to the area of thermal interest through plural ones of the interconnect.

18. The method of claim 16 further comprising adapting the non-compound semiconductor region to receive a heat sink.

19. The method of claim 18 further comprising electrically connecting the interconnect to the heat pump device to apply electricity to the portion.

20. The method of claim 16 wherein the forming comprises forming the non-compound semiconductor region to have a lower thermal resistivity than that of the compound semiconductor region.

21. The method of claim 16 wherein the thermally connecting comprises forming additional interconnect that has a lower resistivity than that of the compound semiconductor region and that is adapted to carry heat between approximately the portion and the non-compound semiconductor region, wherein together the interconnect, the portion, and the additional interconnect form a thermal path approximately between the area of thermal interest and the non-compound semiconductor region.

22. The method of claim 21 wherein the conducting electricity comprises applying electricity to the portion via the additional interconnect.

23. The method of claim 16 wherein the forming comprises forming a temperature sensor in the composite semiconductor structure in close thermal proximity to the area of thermal interest.

24. The method of claim 23 wherein the forming a composite semiconductor structure comprises forming control circuitry in the composite semiconductor structure that controls when the heat pump device is operating.

25. The method of claim 24 further comprising controlling the heat pump device with the control circuitry to temperature regulate the area of thermal interest.

26. The method of claim 23 wherein the forming the temperature sensor comprises forming a diode to be the temperature sensor.

27. The method of claim 16 wherein the forming comprises providing a monocrystalline Group IV semiconductor region to be the non-compound semiconductor region.

28. The method of claim 16 wherein the forming comprises providing a silicon region to be the non-compound semiconductor region.

29. The method of claim 16 wherein the forming comprises providing a monocrystalline Group III-V semiconductor region to be the compound semiconductor region.

30. The method of claim 16 wherein the forming comprises providing a region of gallium arsenide to be the compound semiconductor region.

31. A semiconductor structure comprising:

a monocrystalline silicon substrate;

an amorphous oxide material overlying the monocrystalline silicon substrate;

a monocrystalline perovskite oxide material overlying the amorphous oxide material that includes a portion through which electricity is conducted to move heat;

a monocrystalline compound semiconductor material overlying the monocrystalline perovskite oxide material; and

an interconnect that has a lower thermal resistivity than that of the compound semiconductor material, that thermally connects the portion and the area of thermal interest, and that is electrically insulated from the area of thermal interest.

32. The semiconductor structure of claim 31 wherein the monocrystalline compound semiconductor material is gallium arsenide.

33. The semiconductor structure of claim 31 further comprising an additional interconnect that has a lower thermal resistivity than the compound semiconductor material and that thermally connects the portion to the monocrystalline silicon substrate.

34. The semiconductor structure of claim 31 wherein the interconnect is electrically connected to the portion to apply electricity to the portion.

35. A process for fabricating a semiconductor structure comprising:

providing a monocrystalline silicon substrate;

depositing a monocrystalline perovskite oxide film overlying the monocrystalline silicon substrate, the film having a thickness less than a thickness of the material that would result in strain-induced defects;

forming an amorphous oxide interface layer containing at least silicon and oxygen at an interface between the monocrystalline perovskite oxide film and the monocrystalline silicon substrate;

epitaxially forming a monocrystalline compound semiconductor layer overlying the monocrystalline perovskite oxide film, the monocrystalline compound semiconductor layer including a portion through which electricity is conducted to move heat;

thermally connecting the portion and the area of thermal interest through an interconnect that has a lower thermal resistivity than that of the compound semiconductor material and is electrically insulted from the area of interest.

36. The process of claim 35 wherein the epitaxially forming comprises epitaxially forming the monocrystalline compound semiconductor layer to be a gallium arsenide layer.

37. The process of claim 35 further comprising thermally connecting the portion and the monocrystalline silicon substrate through an additional interconnect that has a lower thermal resistivity than that of the monocrystalline compound semiconductor layer;

38. The process of claim 35 further comprising electrically connecting the interconnect to the portion to apply electricity to the portion.