×

Wafer shape evaluating method and device producing method, wafer and wafer selecting method

  • US 20030023402A1
  • Filed: 08/15/2002
  • Published: 01/30/2003
  • Est. Priority Date: 11/16/2000
  • Status: Active Grant
First Claim
Patent Images

1. A method for evaluating a wafer configuration comprising the steps of:

  • measuring a configuration of a wafer at positions with a prescribed space within a surface of the wafer;

    providing a first region within the wafer surface for calculating a reference line or a reference plane from the measured wafer configuration;

    calculating a reference line or a reference plane in the first region;

    providing a second region to be evaluated outside the first region;

    extrapolating the reference line or reference plane to the second region;

    analyzing a difference between the configuration of the second region and the reference line or reference plane within the second region; and

    calculating the analyzed difference as surface characteristics.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×