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Processes for making a barrier between a dielectric and a conductor and products produced therefrom

  • US 20030025146A1
  • Filed: 07/23/2001
  • Published: 02/06/2003
  • Est. Priority Date: 07/23/2001
  • Status: Active Grant
First Claim
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1. A method of making a barrier on a high k dielectric material, said method comprising the steps of:

  • providing a substrate having an upper surface comprising a high k dielectric material;

    remotely generating a plasma using a nitrogen containing source; and

    flowing the plasma over the upper surface comprising a high k dielectric material to form an oxynitride layer on the upper surface.

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