IMAGE PICKUP DEVICE INCORPORATING A POSITION DEFINING MEMBER

• US 20030025824A1
• Filed: 05/21/1998
• Published: 02/06/2003
• Est. Priority Date: 05/23/1997
• Status: Active Grant

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: ISHIKAWA, KOJI
• Granted Patent: US 6,654,064 B2
• Time in Patent Office: Days
• US Class Current: 348/374
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/10446 Mounted on an edge
• CPC Class Codes: H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/305 Affixing by adhesive
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An image pickup device provided with an optical system for taking the image of an object, a photoelectric converting element for photoelectric conversion of the object image taken by the optical system, an electric signal outputting board for outputting an electrical signal from the photoelectric converting element, and a position defining member for defining the position of the optical system relative to the photoelectric converting element, wherein the electric signal outputting board is positioned between the photoelectric converting element and the position defining member.

Claims

1. An image pickup device comprising an optical system for picking up the image of an object, photoelectric conversion means for photoelectric conversion of the object image picked up by said optical system, electric signal output means for outputting electrical signals from said photoelectric conversion means, and position defining means for defining the position of said optical system and said photoelectric conversion means,

wherein said electric signal output means is positioned between said photoelectric conversion means and said position defining means.

2. An image pickup device according to claim 1, wherein said position defining means has a contact member for contacting with said photoelectric conversion means.

3. An image pickup device according to claim 2, wherein said contact member is composed of plural projections.

4. An image pickup device according to claim 3, wherein said electrical signal output means has such an external shape as to avoid the contact portion between said photoelectric conversion means and said position defining means.

5. An image pickup device according to claim 4, wherein said electrical signal output means has such an external shape in a contact portion with said photoelectric conversion means as to be substantially same as the external shape of said photoelectric conversion means.

6. An image pickup device according to claim 2, wherein said position defining means has an aperture in the vicinity of the contact member for contacting with said photoelectric conversion means.

7. An image pickup device according to claim 1, wherein said photoelectric conversion means is an image pickup element contained in a package.

8. An image pickup device according to claim 1, wherein said electric signal output means is a printed circuit board.

9. An image pickup device according to claim 8, wherein the printed circuit board for mounting the package containing said image pickup element is provided, on a face thereof opposite to the face for electrical connection therewith, with a ground pattern substantially covering said printed circuit board.

10. An image pickup device according to claim 9, wherein said printed circuit board is a flexible printed circuit board.

11. An image pickup device according to claim 9, wherein said printed circuit board is a hard printed circuit board.

12. An image pickup device according to claim 7, wherein said package is a leadless chip carrier package.

13. An image pickup device according to claim 1, which is a digital camera.

14. An image pickup device according to claim 1, which is a video camera.

15. A leadless electric component mounting device for mounting a leadless electric component in a mounting position in the main body of the device, comprising a position defining member for mounting said leadless electric component in a part with a predetermined gap and positioning said leadless electric component in said mounting position, and a printed circuit board connected electrically to an electrode of said leadless electric component and derived through said gap.

16. A leadless electric component mounting device according to claim 15, wherein said leadless electric component is an image pickup element, and said main body of the device is an optical system.

17. A leadless electric component mounting device according to claim 16, wherein said leadless electric component is adhered to said position defining member.

18. A package for a solid-state image pickup element for use in an image pickup device, comprising an image pickup optical system, a package of a chip carrier type containing said solid-state image pickup element, a position defining member for defining the position of said solid-state image pickup package relative to said optical system, and a printed circuit board having a rand for electrical connection with said solid-state image pickup element,

wherein a step difference is formed, on the rear face of said package, between a mounting face for said position defining member and a face for electrical connection with said printed circuit board.

19. An image pickup device comprising:

an image pickup optical system;

a solid-state image pickup package of a chip carrier type containing said solid-state image pickup element;

a position defining member for defining the position of said solid-state image pickup package relative to said optical system; and

a printed circuit board having a rand for electrical connection with said solid-state image pickup element,

wherein a step difference is formed, on the rear face of said package, between a mounting face for said position defining member and a face for electrical connection with said printed circuit board.

20. An image pickup device according to claim 19, wherein said printed circuit board is provided, on a face thereof opposite to the face for electrical connection with said solid-state image pickup element, with a ground pattern for at least covering the rear face of the solid-state image pickup package.

21. An image pickup device comprising a light receiving face formed on the upper face of a package, wherein the bottom face thereof constitutes a face for defining the position in the direction of the optical axis, plural electrodes to be soldered to a board for mounting said image pickup element, formed at least on one of the four lateral faces of said flat package, and an adhesion face for fixation in a state after positioning in said direction of the optical axis, formed on said position defining face.

22. An image pickup element according to claim 21, wherein said position defining face is adapted to impinge on plural position defining projections provided in an image pickup device in which said image pickup element is to be incorporated, and said board is positioned in a space formed between said plural projections.

23. An image pickup element according to claim 22, wherein said board is a flexible printed circuit board, which is provided with holes or notches for avoiding the positions of said projections.

24. A mounting device for an image pickup element, wherein a position defining member for positioning in the direction of the optical axis impinges on the bottom face of a flat package for the image pickup element, and an electrical connection member connected electrically with plural electrodes of said image pickup element is positioned between said bottom face and said position defining member.

28. A mounting device for an image pickup element according to claim 24, wherein said position defining member is fixed by adhesion to the bottom face of said package.

25. A mounting device for an image pickup element according to claim 35, wherein said position defining member is provided with plural projections which impinge on said bottom face to form a space between said bottom face and said position defining member, and said electrical connection member is provided in said space.

26. A mounting device for an image pickup element according to claim 25, wherein said electrical connection member is a flexible printed circuit board.

27. A mounting device for an image pickup element according to claim 26, wherein said position defining member is positioned relative to a lens barrel.